Trial Production of Light Sensor by Laser Direct Drawing

在硅器件的制造过程中，硅片上的许多芯片被分离和封装.特别是光学器件的制造工艺复杂，因为它们需要光学系统。因此，如果硅片和玻璃可以自由键合并在玻璃上布线，则该方法可以作为一种新的器件封装工艺。为了实现这些工艺，本研究的目的是（1）估计激光键合硅片-玻璃的键合强度（2）如果硅片和玻璃上的器件区域直接接触会产生污染云，因此，为了避免直接接触，尝试通过激光照射形成小突起。(3)玻璃的激光加工是困难的，因为它的透明度。然而，如果玻璃通过激光照射加工，则这将是有用的。因此，尝试了玻璃的激光加工，其结果是，（1）通过隔着玻璃对硅晶片照射激光，能够将硅晶片与类接合。键合强度比硅片本身更强。(2)激光照射硅片引起的变化，这种变化可以作为KOH的掩模，并可以使小突起。(3)冷却和冷凝水在玻璃上，使激光加工。

Many chips on silicon wafer are separated and packaged, on the process of silicon device manufacturing. Especially, processes are complicated on the optical devices manufacturing, because they need optical system. Hence, if silicon wafer and glass can be bonded freely and wired on the glass, that method is useful as a new device package process.In order to achieve these process, purposes of this research were (1) estimate the bonding strength of laser bonded silicon wafer - glass (2) contamination cloud be occur if device area on the silicon and glass contact directly, hence, in order to avoid direct contact, small protrusion formation by laser irradiation was tried. (3) Laser processing of the glass was difficult, because of its transparency. However it will be useful if the glass is processed by laser irradiation. Hence, laser processing of glass was tried.As a result, (1) silicon wafer and class could be boned by laser irradiation to silicon wafer through glass. The bonding strength was stronger than silicon wafer itself. (2) Laser irradiation to silicon wafer caused changes, the change could be used as a mask for KOH, and could make small protrusion. (3) Cooling and condensing water on the glass enabled to laser process.