Conformal 3D Ceramic-Based Intelligent GaN Power Systems-in-Package (3D-CeraGaN)

该项目旨在从理论上研究和实验上开发基于GaN的系统级封装（SiP）的三维陶瓷电路载体的潜力。除了3D集成系统在热管理和高功率密度方面提供的新自由度外，还将研究其他优势，如安装空间的一致性，因此小型化和更少的组件。研究重点是基于GaN功率半导体的智能功率模块和基于复杂3d陶瓷的模制互连器件（MID）以及电子衬底的制造工艺，其功能化以及相应的3d组装和互连技术。科学和技术目标可以详细如下：-验证智能功率模块的多物理场设计流程，该模块包含并联GaN功率晶体管，驱动电路和各种传感器作为3D陶瓷电路载体上的SiP。-先进的驱动方法和热设计，以优化平衡并联，快速开关转换器系统中的电流分布，适用于大电流应用。-设计温度和电流传感器及其读出电路，用于超快速故障检测和主动控制，以提高SiP的使用寿命。-与传统转换器相比，用于低压（48v）、大电流（> 100a）引线应用的3d集成gan电源转换器的效率和建筑空间一致性等系统级优势的计量验证。-应结合GaN晶体管，从热、电、机械角度考虑由MID陶瓷组成的混合方法。mid技术的高灵活性、复杂性和适合批量生产的特点，将使其在系统层面具有优势，并增加模块化（例如通过模块堆叠实现并行切换）。-热模型将基于Zth测量和热成像调查有目的地创建，并应与之前在mid和传统2d基板上进行的调查进行比较。-银烧结是电力电子模具连接的既定工艺。然而，在基于陶瓷的MIDs层系统上的应用，到目前为止几乎完全没有被探索过。本项目将研究基板表面对结合质量的影响，以及氮化镓基系统在不同金属化层上的扩散机制。-通过有功功率循环加速老化，并研究基于陶瓷mid的氮化镓电力电子系统的可能失效机制。这些寿命测试将作为寿命模型的基础。

The project aims to theoretically investigate and experimentally exploit the potential of three-dimensional ceramic circuit carriers for GaN based system-in-packages (SiP). Besides the new degrees of freedom offered by 3D integrated systems in terms of thermal management and high power density, additional advantages like the conformity to installation space and therefore miniaturization and fewer components will be investigated. The research focuses on intelligent power modules based on GaN power semiconductors and complex 3D-ceramic-based moulded interconnect devices (MID) and manufacturing processes for electronic substrates, their functionalization as well as the corresponding 3D-assembly and interconnection technology. The scientific and technical goals can be detailed as follows:- Verification of a multi-physics design flow for intelligent power modules containing paralleled GaN power transistors with driver circuits and various sensors as SiP on 3D ceramic circuit carriers.- Advanced driver approach and thermal design for optimized balancing of current distribution in paralleled, fast-switching converter systems for high current applications.- Design of temperature and current sensors and their read-out circuits for ultra-fast fault detection and active control for lifetime enhancement of the SiP.- Metrological verification of system level benefits like efficiency and building space conformance of a 3D-integrated GaN-based power converter for a low-voltage (48 V), high current (>100 A) lead application in comparison to conventional converters.- Hybrid approaches consisting of MID ceramics shall be considered from thermal, electrical & mechanical perspectives in conjunction with GaN transistors. The high flexibility, complexity and suitability for series production of the MID-technology shall enable advantages on system level and increase modularity (e.g. parallel switching by stacking of modules).- Thermal models are to be purposefully created based on Zth measurements & thermographic investigations and shall be compared to previous investigations conducted on MIDs and conventional 2D-Substrates.- Silver sintering is an established process in power electronics die attach. The application on the layer systems of ceramic based MIDs, however, remains almost completely unexplored so far. The effect of the substrate surface on the bonding quality and the diffusion mechanism on different metallization layers for GaN-based systems shall be investigated within this project.- Accelerated aging by Active Power Cycling are to be performed and possible failure mechanisms of GaN power electronics systems based on the ceramic MIDs are to be investigated. These lifetime tests are to serve as a basis for lifetime models.