Development of Hybrid System for Three-Dimensional Heat Conduction and Thermal Stress Analysis Based upon Infraded Temperature Measurement.

在本研究计画中，开发了一个实验与计算混合系统，以进行三维热传导与热应力分析。该系统由红外热像仪和工程工作站组成，红外热像仪可以测量人体表面的真实的时间温度分布，工程工作站可以进行三维热传导和热应力有限元分析。该系统已应用于（1）分析物体的温度和热应力分布，（2）测量胶接接头的传热系数，（3）确定物体表面的未知热流。结果表明，该系统可以有效地分析这些问题。

In this research project an experimental and computational hybrid system for three-dimensional heat conduction and thermal stress analysis has been developed. The system consists of infrared thermography, by which the real time temperature distribution of a body surface can be measured, and an engineering work station (EWS) by which the three-dimensional heat conduction an thermal stress finite element analysis can be carried out. The system has been applied to (1) the analysis of temperature and thermal stress distributions in the body, (2) the measurement of the heat transfer coefficient of a bonded joint and (3) the determination of the unknown heat flux of the body surface. It has been shown that these problems can be analyzed efficiently through the developed system.