STRENGTH EVALUATION OF THERMAL CYCLING FATIGUE FOR SURFACE-MOUNDED SOLDER JOINTS

表面贴装焊点热循环疲劳强度评估

• 批准号: 05555031
• 负责人: SHIRATORI Masaki
• 金额: $ 4.35万
• 依托单位: YOKOHAMA NATIONAL UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Developmental Scientific Research (B)
• 财政年份: 1993
• 资助国家: 日本
• 起止时间: 1993 至 1994
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-05555031/
• 关键词: SURFACE MOUND; SOLDER JOINT; LOW CYCLES FATIGUE; THERMAL CYCLE FATIGUE; ELASTIC-PLASTIC AND CREEP ANALYSIS; 加速試験

In this research project the following results have been gotten :(1) A three-dimensional finite element method program has been developed to carry out the heat conduction and the thermal stress analysis for surface-mound assembly.(2) The heat-cycle fatigue tests were carried out for the solder joints, and the results show good agreement with the analytical results.(3) An experimental method of mechanical fatigue has been proposed as the accelerated test for the heat-cycle fatigue test, and a testing equipment for the mechanical fatigue experiment has been developed.(4) The mechanical fatigue tests were carried out with several kinds of leaded solder joints, and the results show good agreement with the analytical results.(5) The elastic-plastic and creep analytical method has been proposed to investigate the thermal stress-strain behaviors of the solder joint. It is found that by using this method the complicated mechanical behaviors of solder joint can be evaluated accurately.(6) By collecting the analytical and experimental results, it is supposed that the thermal fatigue strength of the solder joints can be predicted by the Coffin-Manson relationship with the modification due the creep behavior.

（1）编制了三维有限元程序，对表面-墩组件进行了热传导和热应力分析。(2)对焊点进行了热循环疲劳试验，结果与分析结果吻合较好。(3)提出了一种机械疲劳试验方法作为热循环疲劳试验的加速试验，并研制了机械疲劳试验装置。(4)对几种含铅焊点进行了机械疲劳试验，试验结果与理论分析结果吻合较好。(5)提出了一种研究焊点热应力应变行为的弹塑性蠕变分析方法。结果表明，该方法能较准确地评价焊点的复杂力学行为。(6)通过收集分析和实验结果，认为可以通过Coffin-Manson关系式并考虑蠕变行为的修正来预测焊点的热疲劳强度。

项目成果

Qiang Yu: "A Study of Mechanical/Thermal Stress Behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging (in press)," Proceedings of the 1995 ASME International, Intersociety Electronic Packaging Conference & Exhib

于强：“电子封装中异种材料全局和局部热失配导致的机械/热应力行为的研究（正在印刷中）”，1995 年 ASME 国际、社会间电子封装会议论文集

白鳥 正樹: "影響関数法による表面実装部品の応力解析" 構造工学における数値解析法シンポジウム論文集. 17. 133-138 (1993)

Masaki Shiratori：“使用影响函数法对表面安装部件进行应力分析”结构工程数值分析方法研讨会论文集 17. 133-138 (1993)。

Masaki Shiratori: "Analysis of Stress Intensity Factors for Surface Cracks in Thermal Stress Field(in press)" 1995 ASME/JSME Pressure Vessls and Piping Conference. (1995)

Masaki Shiratori：“热应力场中表面裂纹的应力强度因素分析（正在印刷中）”1995 ASME/JSME 压力容器和管道会议。

Masaki Shiratori: "Analysis of Stress lntensity Factors and Probabilistic Fatigue Life Assessment for Surface Cracks in Flip chip Solder Joints" Proceedings of the 1993 ASME lnternational Electronics Packaging Conference. Vol.4-1. 487-492 (1993)

Masaki Shiratori：“倒装芯片焊点表面裂纹的应力强度因素分析和概率疲劳寿命评估”1993 年 ASME 国际电子封装会议论文集。

M.Shiratori, Q.Yu, and S.B.Wang: "Computational and Experimental Hybrid Approach to Creep-Fatigue Behavior of Surface-Mounted Solder Joints (in press)" Proceedings of the1995 ASME International, Intersociety Electronic Packaging Conference & Exhibition. (

M.Shiratori、Q.Yu 和 S.B.Wang：“表面贴装焊点蠕变疲劳行为的计算和实验混合方法（正在印刷中）”1995 年 ASME 国际电子封装协会间会议记录