Reliability Design and Multi-mode Fracture Control of Micro Joint Structure in Advanced Electronics Packaging

先进电子封装微接头结构的可靠性设计与多模式断裂控制

基本信息

  • 批准号:
    14350052
  • 负责人:
  • 金额:
    $ 10.82万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 财政年份:
    2002
  • 资助国家:
    日本
  • 起止时间:
    2002 至 2003
  • 项目状态:
    已结题

项目摘要

In this report, mechanical reliability problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. This report consists of seven chapters. The contents of each chapter are as follows. Chapter 1 describes the current surface mount technology of electron devices, the reliability assessment method of surface mounted components, and the necessity and problems of lead-free solder applications. Chapter 2 shows the relationship between reflow condition and the fatigue strength of a solder joint. In Chapter 3, the difference of fracture modes in each lead-free solder joint is noted. Also, the effect of the growth of the intermetallic compound layer and the material properties of solder on the fracture mode of a solder joint are shown using analytical and experimental methods. In Chapter 4, the interface strength of the Sn-Zn system solder joint, which is attracting attention as a low-temperature lead-free … More solder, is analyzed and a technique to improve reliability is proposed. Chapter 5 shows the relationship between the formation of voids and fatigue strength of solder joints using FEM analysis and mechanical shear fatigue tests of CSP joints.In Chapter 6, the hardening characteristics of lead-free solder are examined using mechanical shear fatigue testing. Also, the effect of the hardening rule and creep law on the estimation of stress and nonlinear strain for lead-free solder joints is examined and an elastic-plastic-creep analysis method is proposed, which shows good convergence and high precision. Finally, Chapter 7 presents the conclusions gained from the preceding chapters.Through this study, mechanical reliability problems such as the decrease of interface strength, formation of voids, and the application of a constitutive equation, all of which have become very important in practical applications of lead-free solder, are shown and solutions for these problems are proposed. As the results of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability evaluations as well as to reduce production costs. Less
在这份报告中,无铅焊料在实际应用之前必须解决的机械可靠性问题,用分析和实验的方法进行了研究。本报告由七章组成。各章内容如下。第一章介绍了当前电子器件的表面贴装技术、表面贴装元件的可靠性评估方法以及无铅焊料应用的必要性和存在的问题。第二章介绍了回流焊条件与焊点疲劳强度之间的关系。第三章指出了各种无铅焊点的断裂模式的差异。用分析和实验的方法研究了金属间化合物层的生长和焊料的材料性能对焊点断裂模式的影响。在第四章中,作为一种低温无铅…,锡锌系焊点的界面强度备受关注对更多的焊料进行了分析,并提出了提高可靠性的技术。第五章通过有限元分析和CSP焊点的机械剪切疲劳试验研究了空洞形成与焊点疲劳强度之间的关系。第六章通过机械剪切疲劳试验研究了无铅焊点的硬化特性。研究了硬化准则和蠕变规律对无铅焊点应力和非线性应变估算的影响,提出了一种收敛速度快、精度高的弹塑性蠕变分析方法。最后,第七章总结了前几章的结论,通过本研究,提出了无铅焊料在实际应用中存在的机械可靠性问题,如界面强度降低、空洞的形成、本构方程的应用等,并提出了解决这些问题的方法。通过本文的研究,可以提高无铅焊点的可靠性,提高可靠性评估的效率,降低生产成本。较少

项目成果

期刊论文数量(48)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
于強他: "Sn-Zn系低温鉛フリーはんだ接合部の機械的疲労寿命評価"エレクトロニクス実装学会. 6. 406-413 (2003)
于强等:《Sn-Zn基低温无铅焊点的机械疲劳寿命评估》电子封装学会6. 406-413 (2003)。
  • DOI:
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    0
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于強, 白鳥正樹他: "Impact Reliability of BGA Solder Joints and Dropping Test Method"Proceeding of International Conference on Inter PACK 2003. 1-7 (2003)
于强,Masaki Shiratori等:“BGA焊点的冲击可靠性和跌落测试方法”Inter PACK国际会议记录2003. 1-7 (2003)
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    0
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于強, 金道燮, 陳在哲: "Sn-Zn系低温鉛フリーはんだ接合部の機械的疲労寿命評価"エレクトロニクス実装学会. 6・5. 406-413 (2003)
余强、金道燮、陈载哲:“Sn-Zn基低温无铅焊点的机械疲劳寿命评估”电子封装学会6・5(2003)。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
白鳥正樹, 于強, 澁谷忠弘他: "鉛フリーはんだ接合部におけるボイドの影響"日本機械学会材料力学部門講演会講演論文集. 2・5. 223-224 (2002)
Masaki Shiratori、Qiang Yu、T​​adahiro Shibuya 等:“空洞对无铅焊点的影响”日本机械工程学会材料力学分部论文集 2・5(2002 年)。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
白鳥正樹: "Some Recent Topics on the Strength Reliability of Solder Joints in Electronics Packaging"Proceeding of International Conference on ITherm 2002. 1-10 (2002)
白鸟正树:“电子封装中焊点强度可靠性的一些最新主题”ITherm 国际会议记录 2002. 1-10 (2002)
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SHIRATORI Masaki其他文献

SHIRATORI Masaki的其他文献

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{{ truncateString('SHIRATORI Masaki', 18)}}的其他基金

Study on Evaluation Method for Safety Margin of Degraded Piping Against Seismic Loading with Multi-Fracture Mode
多断裂模式退化管道抗震安全裕度评估方法研究
  • 批准号:
    16360049
  • 财政年份:
    2004
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Study on Impact Strength Evaluation of Micro-Solder Joints in Mobile Electronic Units
移动电子装置微焊点冲击强度评价研究
  • 批准号:
    11555029
  • 财政年份:
    1999
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B).
Thermal Fatigue Life Estimation for Lead - Free Solder Joints
无铅焊点的热疲劳寿命估算
  • 批准号:
    10450046
  • 财政年份:
    1998
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Development of Micro-displacement and low-load fatigue tester and fatigue-strength estimating method for micro structures
微位移低载荷疲劳试验机及微结构疲劳强度估算方法的研制
  • 批准号:
    09555028
  • 财政年份:
    1997
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Development of CAE System for Fatigue Strength Design of Solder Joints in Surface Mount Devices
表面贴装器件焊点疲劳强度设计CAE系统的开发
  • 批准号:
    07455051
  • 财政年份:
    1995
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
The Development of the System that Analyzes Surface Cracks by the Influence Function Method
影响函数法表面裂纹分析系统的研制
  • 批准号:
    07555028
  • 财政年份:
    1995
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
STRENGTH EVALUATION OF THERMAL CYCLING FATIGUE FOR SURFACE-MOUNDED SOLDER JOINTS
表面贴装焊点热循环疲劳强度评估
  • 批准号:
    05555031
  • 财政年份:
    1993
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Developmental Scientific Research (B)
DEVELOPMENT OF FLAW DETECTING SYSTEM BY INFRARED THERMOGRAPHY
红外热像探伤系统的研制
  • 批准号:
    05452124
  • 财政年份:
    1993
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)
Development of Hybrid System for Three-Dimensional Heat Conduction and Thermal Stress Analysis Based upon Infraded Temperature Measurement.
基于红外温度测量的三维热传导和热应力分析混合系统的开发。
  • 批准号:
    02650067
  • 财政年份:
    1990
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (C)
Development of Real Time Stress Measurement System by Infrared Thermal Video System
红外热视频系统实时应力测量系统的研制
  • 批准号:
    61850019
  • 财政年份:
    1986
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Developmental Scientific Research

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Preparation of functional hard coating films with multilayer structure via pulsed sputtering plasma with high-density
高密度脉冲溅射等离子体制备多层结构功能性硬质涂层薄膜
  • 批准号:
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用于下一代超导加速器的超导多层结构
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    17H04839
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    2017
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Analysis of ferroelectric tunnel effect and realization of new memory device by atomically flat nano-multilayer structure fabrication
铁电隧道效应分析及原子级平坦纳米多层结构制造新型存储器件的实现
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    15K05999
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    2015
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多层结构环保型压电聚合物薄膜执行器的研制
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Developing an electro-acoustic transducer using a multilayer structure
开发使用多层结构的电声换能器
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Analysis of Multilayer Structure Constituted by Light-Elements with Total Reflection PIXE
全反射PIXE光元件多层结构分析
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    1997
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