Reliability Design and Multi-mode Fracture Control of Micro Joint Structure in Advanced Electronics Packaging

先进电子封装微接头结构的可靠性设计与多模式断裂控制

• 批准号: 14350052
• 负责人: SHIRATORI Masaki
• 金额: $ 10.82万
• 依托单位: Yokohama National University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2002
• 资助国家: 日本
• 起止时间: 2002 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-14350052/
• 关键词: Electronics packaging; Multilayer structure; Fracture control; Interfacial fracture; Thermal fatigue; Lead-free solder; Intermetallic compound; Reliability design

In this report, mechanical reliability problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. This report consists of seven chapters. The contents of each chapter are as follows. Chapter 1 describes the current surface mount technology of electron devices, the reliability assessment method of surface mounted components, and the necessity and problems of lead-free solder applications. Chapter 2 shows the relationship between reflow condition and the fatigue strength of a solder joint. In Chapter 3, the difference of fracture modes in each lead-free solder joint is noted. Also, the effect of the growth of the intermetallic compound layer and the material properties of solder on the fracture mode of a solder joint are shown using analytical and experimental methods. In Chapter 4, the interface strength of the Sn-Zn system solder joint, which is attracting attention as a low-temperature lead-free … More solder, is analyzed and a technique to improve reliability is proposed. Chapter 5 shows the relationship between the formation of voids and fatigue strength of solder joints using FEM analysis and mechanical shear fatigue tests of CSP joints.In Chapter 6, the hardening characteristics of lead-free solder are examined using mechanical shear fatigue testing. Also, the effect of the hardening rule and creep law on the estimation of stress and nonlinear strain for lead-free solder joints is examined and an elastic-plastic-creep analysis method is proposed, which shows good convergence and high precision. Finally, Chapter 7 presents the conclusions gained from the preceding chapters.Through this study, mechanical reliability problems such as the decrease of interface strength, formation of voids, and the application of a constitutive equation, all of which have become very important in practical applications of lead-free solder, are shown and solutions for these problems are proposed. As the results of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability evaluations as well as to reduce production costs. Less

在这份报告中，机械可靠性问题，必须解决之前，无铅焊料可以在实际应用中使用，使用分析和实验方法进行检查。本报告共分七章。各章内容如下。第一章介绍了当前电子器件的表面贴装技术，表面贴装元件的可靠性评估方法，以及无铅焊料应用的必要性和存在的问题。第二章介绍了回流焊条件与焊点疲劳强度的关系。在第三章中，指出了各个无铅焊点中断裂模式的差异。此外，金属间化合物层的生长和焊料的材料特性上的焊点的断裂模式的效果示出使用分析和实验方法。第四章研究了作为低温无铅焊料而备受关注的Sn-Zn系焊点的界面强度 ...更多信息 焊料，并提出了一种技术，以提高可靠性。第五章通过CSP焊点的有限元分析和机械剪切疲劳试验研究了焊点中空洞的形成与焊点疲劳强度的关系。第六章通过机械剪切疲劳试验研究了无铅钎料的硬化特性。此外，硬化规则和蠕变规律的无铅焊点的应力和非线性应变的估计的效果进行了检查，并提出了一种弹塑性蠕变分析方法，该方法具有良好的收敛性和高精度。最后，第七章总结了前面几章的研究结果，指出了无铅焊料在实际应用中遇到的一些重要的机械可靠性问题，如界面强度的降低、空洞的形成以及本构方程的应用等，并提出了解决这些问题的方法。作为本研究的结果，有可能提高无铅焊点的可靠性和可靠性评估的效率，以及降低生产成本。少

项目成果

于強他: "Sn-Zn系低温鉛フリーはんだ接合部の機械的疲労寿命評価"エレクトロニクス実装学会. 6. 406-413 (2003)

于强等：《Sn-Zn基低温无铅焊点的机械疲劳寿命评估》电子封装学会6. 406-413 (2003)。

于強, 白鳥正樹他: "Impact Reliability of BGA Solder Joints and Dropping Test Method"Proceeding of International Conference on Inter PACK 2003. 1-7 (2003)

于强，Masaki Shiratori等：“BGA焊点的冲击可靠性和跌落测试方法”Inter PACK国际会议记录2003. 1-7 (2003)

于強, 金道燮, 陳在哲: "Sn-Zn系低温鉛フリーはんだ接合部の機械的疲労寿命評価"エレクトロニクス実装学会. 6・5. 406-413 (2003)

余强、金道燮、陈载哲：“Sn-Zn基低温无铅焊点的机械疲劳寿命评估”电子封装学会6・5（2003）。

白鳥正樹: "Some Recent Topics on the Strength Reliability of Solder Joints in Electronics Packaging"Proceeding of International Conference on ITherm 2002. 1-10 (2002)

白鸟正树：“电子封装中焊点强度可靠性的一些最新主题”ITherm 国际会议记录 2002. 1-10 (2002)

白鳥正樹, 于強他: "Dynamic behavior of electronics package and impact reliability of BGA solder joints"Damage and Fracture Mechanics. 7. 55-64 (2002)

Masaki Shiratori、Qiang Yu 等人：“电子封装的动态行为和 BGA 焊点的影响可靠性”《损伤与断裂力学》。 7. 55-64 (2002)