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Reliability Design and Multi-mode Fracture Control of Micro Joint Structure in Advanced Electronics Packaging

先进电子封装微接头结构的可靠性设计与多模式断裂控制

基本信息

批准号：
14350052
负责人：
SHIRATORI Masaki
金额：
$ 10.82万
依托单位：
Yokohama National University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2003
项目状态：
已结题

项目摘要

In this report, mechanical reliability problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. This report consists of seven chapters. The contents of each chapter are as follows. Chapter 1 describes the current surface mount technology of electron devices, the reliability assessment method of surface mounted components, and the necessity and problems of lead-free solder applications. Chapter 2 shows the relationship between reflow condition and the fatigue strength of a solder joint. In Chapter 3, the difference of fracture modes in each lead-free solder joint is noted. Also, the effect of the growth of the intermetallic compound layer and the material properties of solder on the fracture mode of a solder joint are shown using analytical and experimental methods. In Chapter 4, the interface strength of the Sn-Zn system solder joint, which is attracting attention as a low-temperature lead-free … More solder, is analyzed and a technique to improve reliability is proposed. Chapter 5 shows the relationship between the formation of voids and fatigue strength of solder joints using FEM analysis and mechanical shear fatigue tests of CSP joints.In Chapter 6, the hardening characteristics of lead-free solder are examined using mechanical shear fatigue testing. Also, the effect of the hardening rule and creep law on the estimation of stress and nonlinear strain for lead-free solder joints is examined and an elastic-plastic-creep analysis method is proposed, which shows good convergence and high precision. Finally, Chapter 7 presents the conclusions gained from the preceding chapters.Through this study, mechanical reliability problems such as the decrease of interface strength, formation of voids, and the application of a constitutive equation, all of which have become very important in practical applications of lead-free solder, are shown and solutions for these problems are proposed. As the results of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability evaluations as well as to reduce production costs. Less

在这份报告中，无铅焊料在实际应用之前必须解决的机械可靠性问题，用分析和实验的方法进行了研究。本报告由七章组成。各章内容如下。第一章介绍了当前电子器件的表面贴装技术、表面贴装元件的可靠性评估方法以及无铅焊料应用的必要性和存在的问题。第二章介绍了回流焊条件与焊点疲劳强度之间的关系。第三章指出了各种无铅焊点的断裂模式的差异。用分析和实验的方法研究了金属间化合物层的生长和焊料的材料性能对焊点断裂模式的影响。在第四章中，作为一种低温无铅…，锡锌系焊点的界面强度备受关注对更多的焊料进行了分析，并提出了提高可靠性的技术。第五章通过有限元分析和CSP焊点的机械剪切疲劳试验研究了空洞形成与焊点疲劳强度之间的关系。第六章通过机械剪切疲劳试验研究了无铅焊点的硬化特性。研究了硬化准则和蠕变规律对无铅焊点应力和非线性应变估算的影响，提出了一种收敛速度快、精度高的弹塑性蠕变分析方法。最后，第七章总结了前几章的结论，通过本研究，提出了无铅焊料在实际应用中存在的机械可靠性问题，如界面强度降低、空洞的形成、本构方程的应用等，并提出了解决这些问题的方法。通过本文的研究，可以提高无铅焊点的可靠性，提高可靠性评估的效率，降低生产成本。较少