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Development of CAE System for Fatigue Strength Design of Solder Joints in Surface Mount Devices

表面贴装器件焊点疲劳强度设计CAE系统的开发

基本信息

批准号：
07455051
负责人：
SHIRATORI Masaki
金额：
$ 5.38万
依托单位：
Yokohama National University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07455051/
关键词：
Assembly Solder Joints Elasto-plastic creep Strength of low-cycle fatigue Thermal cycle fatigue

项目摘要

In order to study the get a cyclic stress-strain hysteresis in microelectronic solder joints during a temperature cyclic test, a TSOP,a BGA and a LCCC were modeled for FEA,and a stress-strain evaluating system for solder joints has been developed. The analytic results show that for a temperature cyclic test, long high-temperature and low-temperature dwell times do not contribute to the cyclic strain range in solder joint so much. Based upon the results of the strain analyzes, some efficient testing processes of temperature cycling and mechanical fatigue experiments for the microelectronics solder joint were proposed, and the cycling tests were carried out. The experimental results show a good agreement with the analytic results. The proposed thermal cyclic accelerated test method can save over 50% testing time than an usual methods, and the experimental results showed that the proposed mechanical fatigue test method can be used as a good accelerated test method for the thermal fatigue strength of solder joints. It was shown that the fatigue life of TSOP and BGA solder joints could be estimated by Manson-Coffin's low as N_f=A DELTAepsilon_<in>^n. Further more a CAE system for fatigue strength estimation of solder joints has been developed based upon the statistical optimization method (SOM) and experimental results. It was shown that SOM could be used as a very practical tool to conduct fatigue design of solder joints. The fatigue life of BGA solder joints subjected to operating conditions was estimated, and the results showed that the fatigue life is greatly affected by not only the temperature changing range but also by the mean temperature. In the CAE system, a mathematical programming (successive quadratic programing) was employed to solve the optimization problem of the weight of solder joints.

为了研究微电子焊点在温度循环试验过程中的应力-应变循环滞后现象，建立了TSOP、BGA和LCCC的有限元模型，开发了焊点应力-应变评估系统。分析结果表明，对于温度循环试验，较长的高温和低温停留时间对焊点的循环应变范围的贡献不大。根据应变分析结果，提出了微电子焊点温度循环和机械疲劳试验的有效测试方法，并进行了循环试验。实验结果与分析结果吻合较好。试验结果表明，该机械疲劳试验方法可以作为焊点热疲劳强度的一种良好的加速试验方法。结果表明，TSOP和BGA焊点的疲劳寿命可以用Manson-Coffin公式N_f=A来估算，并基于统计优化方法和实验结果开发了焊点疲劳强度的CAE系统。结果表明，SOM可以作为一种非常实用的工具进行焊点的疲劳设计。对运行条件下BGA焊点的疲劳寿命进行了估算，结果表明，BGA焊点的疲劳寿命不仅受温度变化范围的影响较大，而且受平均温度的影响也较大。在CAE系统中，采用了数学规划(逐次二次规划)方法来解决焊点重量的优化问题。