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Research on a method of temperature measurement for a silicon semiconductor wafer

Research on a method of temperature measurement for a silicon semiconductor wafer
硅半导体晶片温度测量方法的研究
批准号:
13650468
负责人:
IUCHI Tohru
金额:
$1.79万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2001
资助国家:
日本
项目状态:
已结题
起止时间:
2001 至 2002

项目摘要

项目成果

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中文摘要
翻译
在2001年至2002年这两年中取得了以下成果:(1)研制了硅片室温附近和1000 K以上高温下发射率测量的实验装置。利用这些仪器,可以测量光谱、定向和偏振发射率。(2)通过对市售薄膜测量设备的改造,研制了400 ~ 1100nm波长范围内高温(~ 1100k)下硅晶片光学常数和薄厚度的测量装置。(3)提出了利用接触式和非接触式两种技术优点对被测物体进行测量的混合式表面温度计的概念。这个想法很有希望监测硅片的表面温度,在热电偶上焊接非常困难。这种实际使用的混合表面温度计目前正在开发中。(4)完成了硅片的发射率建模。利用该模型,可以模拟多种条件下的发射率行为。通过仿真得到了发射率不变的条件。在某些条件下,硅晶片的发射率与氧化膜厚度的变化无关。这一发现需要实验证实。部分研究成果已发表在《应用光学》和《Trans》等期刊上。SICE的申请并成功通过。在国内外研讨会和会议上发表论文16篇。混合表面温度计和发射率不变条件很快就会申请专利,因为它们是原创的和有用的。
英文摘要
Following results have been achieved during the past two years from 2001 to 2002.(1) Experimental apparatuses for emissivity measurements of silicon wafers near room temperature and at high temperature over 1000 K have been developed. Using these apparatuses, spectral, directional and polarized emissivities can be measured.(2) By revamping a commercially available equipment for thin film measurement, a measurement apparatus for optical constants and thin thickness of a silicon wafer at high temperature (〜1100 K) and at wavelength from 400 to 1100 nm has been developed.(3) The conception of a hybrid type surface thermometer that utilizes both advantages of contact and non-contact techniques to a measured object has been obtained .this idea is promising for monitoring the surface temperature of a silicon wafer, welding on a thermocouple on which is very difficult. This hybrid surface thermometer for practical use is now under development.(4) Emissivity modeling for silicon wafer has completed. Using this modeling, emissivity behaviors under a lot of conditions can be simulated. The emissivity-invariant condition has been found through the simulation. Emissivity of a silicon wafer is unchanged under some conditions irrespective of changes of oxide film thickness. Experimental confirmation is necessary for this finding.Part of these results have been submitted to journals such as Applied Optics and Trans. of SICE and successfully accepted. 16 papers have been published at international and domestic workshops and conferences.The hybrid surface thermometer and the emissivity-invariant condition are soon intended to apply for patents because these are original and useful.
期刊论文(42)
专著(0)
科研奖励(0)
会议论文
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通讯作者:
T.Iuchi: "Modeling of emissivities of metals and their behaviors during the growth of the oxide film"TEMPERATURE. 7(in print). (2002)
T.Iuchi:“金属发射率及其在氧化膜生长过程中的行为的建模”温度。
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菅原弘司, 福島忠和, 井内徹: "常温付近でのSi半導体ウエハの放射測温法の研究"第1回東洋大学工業技術技術研究所講演会. 21-22 (2003)
菅原浩、福岛忠一、井内彻:“室温附近硅半导体晶片的辐射测温研究”东洋大学产业技术研究所第1次讲座21-22(2003年)。
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福島忠和, 大久保智裕, 井内徹: "Si半導体ウエハの放射率測定"第63回応用物理学会学術講演会. 25a-S-7. (2002)
Tadakazu Fukushima、Tomohiro Okubo、Toru Inouchi:“硅半导体晶片的发射率测量”,日本应用物理学会第 63 届年会(2002 年)。
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共 40 条
    Design and construction of radiation thermometry systems under extremely nonequilibrium temperature condition
    • 批准号:
      23560511
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $3.24万
    • 财政年份:
      2011
    • 负责人:
      IUCHI Tohru
    • 依托单位:
    In-situ radiation thermometry of semiconductor materials and its calibration system
    • 批准号:
      20560403
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $2.91万
    • 财政年份:
      2008
    • 负责人:
      IUCHI Tohru
    • 依托单位:
    Research of the in-situ temperature measurement system for silicon wafers.
    • 批准号:
      17560377
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $2.18万
    • 财政年份:
      2005
    • 负责人:
      IUCHI Tohru
    • 依托单位:
    Study on the method for the measurements of both emissivity and temperature of semiconductor materials.
    • 批准号:
      15560364
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $2.05万
    • 财政年份:
      2003
    • 负责人:
      IUCHI Tohru
    • 依托单位:
    海外基金