Development of a new bonding method for glass with metal by application of principle of anodic bonding

由于焊料对玻璃的润湿性很差，玻璃的焊接需要一些预处理，如玻璃表面的金属化或使用特定成分的焊料。本研究将阳极键合原理应用于金属与玻璃的焊接中，以提高焊料与玻璃的附着力。在金属与玻璃的焊接过程中，利用焊料阳极对焊料和玻璃施加交流电压，并研究其对接头性能的影响。在用纯锡焊料焊接时，施加适当时间长度的电压可提高接头强度。由于在焊料/玻璃界面产生过量的氧化锡，长时间施加电压会破坏接头强度。实际的焊料合金应用于这种焊接方法，应用直流电压，“阳极焊接”。直流电压对Sn-3%Sb焊料的焊接有积极作用。但在用Sn-3.5%Ag焊接时效果不佳。银与阳极键合没有接合性，因为银在施加电压时渗透到玻璃中，抑制了使玻璃和导体紧密接触的库仑力的积累。认为Sn-3.5%Ag中的Ag成分在阳极焊接中也有类似的效果。锡和锡基焊料表面覆盖有天然氧化形成的氧化锡。该氧化层降低了锡合金对其他材料的润湿性，并干扰了锡合金的连接。在阳极焊接中采用卤化处理来弱化氧化层。焊料在使用前暴露在盐酸中。卤化显著提高了焊料对玻璃的润湿性。在阳极焊接中，卤化处理改善了焊料在接头界面处的延伸，对接头的性能产生了良好的影响。

Soldering of glass needs some pretreatment like metallizing of glass surface or use of solder with particular component because wettability of solder to glass is very poor. In this study, principle of anodic bonding was applied to soldering of metal to glass in order to improve adhesion of solder to glass A.D.C. voltage was applied to solder and glass with the solder anodic during soldering of metal to glass, and effect on performance of joints was investigated. In soldering with pure tin solder application of the voltage for a proper time length improved the joint strength. Too long application of the voltage damaged joint strength, because of excess generation of tin oxide at the solder/glass interface. Practical solder alloys were applied far this soldering method with application of D.C. voltage, 'anodic soldering'. Application of D.C. voltage was active in soldering by Sn-3%Sb solder. But in soldering by Sn-3.5%Ag it was not effective. Silver has no joinability with anodic bonding, because silver penetrates into the glass during application of the voltage, and inhibits buildup of the coulomb force that brings glass and conductor into intimate contact. It was thought that the Ag component in Sn-3.5%Ag had similar effect in anodic soldering. The surfaces of tin and tin-based solder are covered with tin oxide fumed by native oxidation. This oxide layer degrades wettability of tin alloy to other materials and disturbs joining of tin alloys. Halogenation treatment to solder for weakening of this oxide layer was applied to the anodic soldering. Solder was exposed to of HCl just before use. Halogenation improved wettability of solder to glass prominently. In anodic soldering, halogenation treatment improved extension of solder at the joint interface,and produced a good effect on performance of the joints.