Silicon Carbide Interconnect Optimisation Project

碳化硅互连优化项目（SCIOP）旨在为电力电子领域开发一种新型的芯片互连。该项目的目标是探索替代材料，工艺和粘合技术，有助于提高功率模块的性能和简化生产工艺。由于电力电子技术的普及性（电动机、电网等），电力电子技术的使能技术的性能得到提高并成本降低，有潜力在帮助英国利用半导体创新方面做出重大贡献，并在更广泛的背景下帮助转向低碳经济。

The Silicon Carbide Interconnect Optimisation Project (SCIOP) aims to develop a novel form of die interconnect for the power electronics sector. The project objectives are to explore alternative materials, processes and adhesion technologies which can contribute to improved power module performance and simplified production processes. Improved performance and reduced cost in the enabling technologies of power electronics, due to the pervasive nature of the technology (electric motors, power grids, etc.), has the potential to make a significant contribution in helping the UK exploit semiconductor innovation and in a broader context help move to a low-carbon economy.