CHRONIC TRANSCRANIAL ELECTRICAL CONNECTOR

本建议书中描述的设备可满足以下需求 NINDS用于高密度经皮穿透和 神经假体用植入式电连接器。的目标是 建议的研究是为老年人开发一种慢性病系统 经颅向高密度传输信号和电力， 植入哺乳动物感觉器官的多通道电极阵列 运动皮质。这个概念是为了一个由密封性 可容纳VLSI电路的多层陶瓷封装，例如 多路复用器、放大器和遥测。它可以安装在 在头骨的顶部或平面内，并连接到电极阵列 无论是带状电缆还是多线束，陶瓷封装 还将提供与外部环境连接的手段； 最初，该系统将使用一个安装在 包裹，从头皮上突出出来。VLSI多路复用和预分插 密封陶瓷封装中的放大电路将允许 使用简单的电缆连接器，即使是大型阵列也是如此。技术 最终将为互联互通提供基础 用于人体神经假体实验的系统 申请。

The device described in this proposal addresses the need identified by the NINDS for high-density percutaneous feedthroughs and implantable electrical connectors for neural prosthesis. The goal of the proposed research is to develop a chronic system for the transcranial delivery of signals and power to and from high density, multichannel electrode arrays implanted in mammalian sensory and motor cortexes. The concept is for a system consisting of a hermetic multilayer ceramic package that can house VLSI circuitry such as multiplexers, amplifiers and telemetry. It can be mounted either on top of, or in the plane of, the skull and connects to the electrode array with either a ribbon cable or a multiwire bundle, the ceramic package will also provide a means of connecting to the external environment; initially the system will use an electrical socket, mounted on the package, that protrudes from the scalp. VLSI multiplexing and pre- amplification circuitry in the hermetic ceramic package will allow the use of simple cable connectors, even for large arrays. The technology to be developed will ultimately provide the basis for interconnect systems to be used in human experimentation with neuroprosthetic applications.