Analytical models for complex, heterogeneous structures

像微处理器这样的大型半导体集成电路是已知的最复杂的工程结构。矛盾的是，它们是由根据非常简单的规则设计的非常简单的组件组成的。这种简单性使得使用计算机软件自动设计和检查布置图中的错误和问题成为可能。这个项目旨在刺激芯片上复杂结构的发展，这些结构不仅仅是电子的，还可能包括小型机器或用于各种应用的气体通道，比如“芯片上的实验室”。这个项目的重点是“布局”，这张图显示了所有晶体管的形状和位置，互连线，以及芯片的所有其他方面，因为它们被制造出来。该项目的目的是开发软件工具来自动分析布局，以确定芯片属性对制造过程变化的敏感性。这些变化不仅会影响芯片的性能，还会影响电流通过芯片时嵌入芯片的导线加热的方式。该项目将继续将相同的快速自动化分析应用于其他物理效应，如气体扩散和机械偏转。芯片布局的非电气方面的自动化分析将意味着工程师可以分析结合电气和非电气功能的芯片。这将使他们能够在芯片上设计比以往任何时候都更复杂的结构，并检查他们的设计，以确保他们不必先建造它们就能工作。这将使基于这些复杂结构的新产品开发更快，风险更小，更可行。

Large semiconductor integrated circuits such as microprocessors are the most complex engineered structures known.  Paradoxically, they are composed of very simple components designed according to very simple rules.  This simplicity makes it possible to use computer software to automate their design and to check the layout drawings for errors and problems.  This project aims to spur development of complex structures on chips that aren't simply electronic, but might also include small machines or gas channels for all sorts of applications such as "labs-on-a-chip."  The focus in this project is on the "layout," the drawing which shows the shapes and placement of all the transistors, interconnecting wires, and all other aspects of the chip, as they are to be manufactured.  The purpose of this project is to develop software tools to automatically analyse the layout to determine the sensitivity of the chip's properties to variations in the manufacturing process.  These variations can not only affect chip performance but also the ways that the wires embedded within chips heat up as electric current passes through them.  The project will go on to apply the same rapid, automated analysis to other physical effects such as diffusion of gas and mechanical deflection.  Automating the analysis of non-electrical aspects of a chip layout will mean that engineers can analyse chips which combine electrical and non-electrical functions.  This will enable them to design more complex structures on chips than ever before and to check their designs to make sure they'll work without having to build them first.  This will make the development of new products based on these complex structures faster, less risky, and more feasible.