2D material thin-film transistors and components for RF/mixed-signal applications

手持通信覆盖了超过20亿人，将他们与全球经济中的社交网络、娱乐、银行和商业交易联系起来。对更高连接性的需求正在推动创新，为未来几代具有先进显示屏的手持和可穿戴移动设备提供轻巧、灵活和透明的电子产品。尽管传统薄膜晶体管（TFT）取得了进步，但其脆弱的性质和低速度使其不适合RF/混合信号电子电路或显示器。二维（2D）电子材料承诺在接近单个原子厚度的层中以较低的功耗改善机械稳定性、光学透明度和非常高的速度。我们的研究团队正在探索令人兴奋的新途径，以未来的无线设备和显示器使用2D材料TFT和组件的RF/混合信号电路应用在这个战略项目。过渡金属硫属化物（TMC，如MoS 2）将使用喷墨打印集成在2D层中。印刷电子使得能够制造具有均匀结构和电气特性的溶液处理的2D器件。我们的研究人员在该项目中开发的计算机模拟工具将准确预测2D材料TFT的行为。这些模拟将指导改进的TFT和电路原型的制造和设计的改进。多层2D材料具有提高RF部件性能的高潜力（例如，传输线和电感器）和电路，与今天的硅芯片相比。利用多层石墨烯的上级电性能的无源器件将在原型RF前端滤波器和RFID接收器中得到证明。用于存储器和TFT电路微调的可编程结构被纳入RFID演示器中，以提高其鲁棒性并增加混合信号功能。该战略项目对于加拿大确保新的创新并在无线技术和物联网（IoT）连接的新兴市场中建立领导地位至关重要。

Handheld communication reaches more than 2B people, connecting them to social networks, entertainment, and banking and business transactions across the global economy. The demand for greater connectivity is driving innovation toward lightweight, flexible, and transparent electronics for the future generations of handheld and wearable mobiles with advanced displays. Despite advances in conventional thin-film transistors (TFTs), their fragile nature and low speed make them unsuitable for RF/mixed-signal electronic circuits or displays. Two-dimensional (2D) electronic materials promise improved mechanical stability, optical transparency, and very high speed at lower power consumption in a layer approaching the thickness of a single atom. Our research team is exploring exciting new pathways to future wireless devices and displays using 2D-material TFTs and components for RF/mixed-signal circuit applications in this strategic project. Transition-metal chalcogenides (TMC, such as MoS2) will be integrated in 2D layers using inkjet printing. Printed electronics enables fabrication of solution processed 2D devices having uniform structural and electrical characteristics. Computer simulation tools developed in the project by our researchers will predict the 2D-material TFTs behaviours accurately. These simulations will guide refinement of the fabrication and design of improved TFTs and circuit prototypes. Multi-layer 2D materials have a high potential to raise the performance of RF components (e.g., transmission lines and inductors) and circuits substantially compared to today's silicon chips. Passives exploiting the superior electrical properties of multi-layer graphene will be demonstrated in a prototype RF front-end filter and an RFID receiver. Programmable fabrics for memory and trimming of TFT circuits are incorporated in the RFID demonstrator to improve its robustness and add mixed-signal capabilities. This strategic project is vital for Canada to secure new innovations and establish leadership in wireless technologies and the emerging market for connectivity to the internet of things (IoT).