High-performance electromagnetic solver for 3D silicon interposers

三维集成为提高集成电路的性能带来了巨大的希望，并引起了先进微设备公司(Markham，On)的极大兴趣，该公司是计算机和显卡所用图形ASIC(专用集成电路)的领先制造商之一。然而，这种革命性类型的电路中的互连的电磁分析是一项艰巨的任务，目前非常耗时。这项提议的目标是 开发一种高性能的电磁解算器，AMD可以使用它来高效地设计3D集成电路。拟议的研究将有助于开发速度更快的显卡，并帮助加拿大保持其在 微电子学。

Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and is of significant interest for Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphic ASICs (application-specific integrated circuits) for inclusion in computers and graphic cards. The electromagnetic analysis of interconnects in this revolutionary type of circuit is however a formidable task, and is currently very time consuming. The goal of this proposal is to develop a high-performance electromagnetic solver that AMD can use to efficiently design 3D integrated circuits. The proposed research will contribute to the development of faster graphic cards, and help Canada to maintain its leading role in microelectronics.