Compact and Energy Efficient Wireless Microelectromechanical Sensing Systems

与集成电路(IC)一样，微电子机械系统(MEMS)是一种颠覆性技术，可以增强系统并实现新的应用。MEMS市场正在以越来越快的速度扩张，预计将从2014年的110亿美元增加近一倍，到2020年达到210亿美元[Yole，2015]。最近，MEMS传感器的出现越来越多，特别是在可穿戴设备(例如智能手表、健身跟踪器)和传感器节点(例如跟踪、天气预报)中，许多传感器被组合在一起。这需要更紧密的集成，以实现更紧凑的系统，并需要无线接口来传输传感器遥测并允许更多的移动性。这类传感器适合于即将到来的物联网，届时将部署大量独立于电源和布线基础设施的小型自主传感器节点，部署开销将大大降低。*IC可以实现这种紧凑型MEMS传感器所需的电路。然而，由于微制造工艺的不兼容性和特定设计的复杂性，单封装与多个MEMS的集成仍然很困难。此外，能源效率正成为系统集成的关键挑战，因为人们强烈要求将传感器部署到电池较小、能量容量不足以满足所需功能的设备中。通过降低无线和接口电子设备的功耗，并使用能量采集器来增强传感器，可以提高效率。因此，本研究计划的愿景是将传统上相互脱节的传感系统功能(即传感器、传感接口、无线通信和能源)集成到单个封装中，或者最终集成到单个芯片中。纳布基教授将利用他的研究专长、最新进展和独特的MEMS、IC和集成技术，通过追求3个短期研究目标来实现这一愿景：i)精心设计适合以上IC集成和换能器融合的MEMS换能器；ii)研究高能效的传感接口和无线通信IC；和iii)探索混合式机械能量采集器以提高传感器的能效。*最终，该研究计划将促进低成本、小尺寸无线传感器的创建，这些传感器可以在各种环境和应用中使用，在MEMS、能量收集、传感、低功率IC和集成领域取得进展，这些领域对加拿大的研究具有重大贡献。这些新传感器将在交通、医疗、环境和工业流程等领域产生压倒一切的适用性和影响，增强加拿大的竞争力。在研究项目期间培训的10名HQP(2名学士、3名硕士、5名博士)将为加拿大经济获得有价值和有市场的先进制造和设计技能。

Like integrated circuits (ICs), microelectromechanical systems (MEMS) are a disruptive technology, enhancing systems and enabling new applications. The MEMS market is expanding at an increasing rate, projected to almost double from $11B in 2014 to $21B in 2020 [Yole, 2015]. Recently, MEMS sensors have had an increased presence, notably in wearables (e.g. smartwatches, fitness trackers) and sensor nodes (e.g. tracking, weather forecasting), where many sensors are combined. This warrants tighter integration to allow for more compact systems, and requires wireless interfaces to transmit sensor telemetry and allow for more mobility. Such sensors are suited to the upcoming Internet-of-Things, where large numbers of small and autonomous sensor nodes, independent of power and wiring infrastructure, are expected to be deployed with a much reduced deployment overhead.******ICs can enable the circuitry required within such compact MEMS sensors. However, single-package integration with multiple MEMS remains difficult because of microfabrication process incompatibilities and specific design intricacies. Furthermore, energy efficiency is becoming a key challenge to system integration, as there is a strong push to deploy sensors into devices with smaller batteries, having insufficient energy capacity for the desired functionalities. Efficiency can be improved by reducing the power consumption of the wireless and interface electronics, and enhancing the sensor with energy harvesters.******Accordingly, the vision of this research program is to integrate traditionally disjointed functions of sensing systems (i.e., transducer, sensing interface, wireless communication, and energy source) within a single package or, ultimately, a single die. Prof. Nabki will use his research expertise, recent progress and unique MEMS, ICs and integration technologies to attain this vision by pursuing 3 short term research objectives: i) elaborate MEMS transducers well-suited to above-IC integration and to transducer fusion; ii) investigate highly energy-efficient sensing interfaces and wireless communication ICs; and iii) explore hybrid mechanical energy harvesters to increase sensor energy efficiency.******Ultimately, this research program will facilitate the creation of low-cost, small form factor wireless sensors that can be used in a variety of environments and applications, yielding advances in the fields of MEMS, energy harvesting, sensing, low-power ICs and integration, which represent significant contributions to research in Canada. These new sensors will have an overarching applicability and impact in sectors such as transportation, healthcare, environment and industrial processes, strengthening Canada's competitiveness. The 10 HQP trained during the research program (2 BEng, 3 MASc, 5 PhD) will gain valuable and marketable advanced manufacturing and design skills for the Canadian economy.