课题基金 / 基金详情

PCB film application in injection molding

PCB film application in injection molding
PCB薄膜在注塑中的应用
批准号:
543402-2019
负责人:
Wawrow, Peter
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Applied Research and Development Grants - Level 1
财政年份:
2019
资助国家:
加拿大
项目状态:
已结题
起止时间:
2019-01-01 至 2020-12-31

项目摘要

项目成果

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中文摘要
翻译
柔性电子/电路使得能够制造更小的产品和复杂的电路。将这些柔性电路嵌入电子设备外壳的能力将增加其制造效益,使这一具有挑战性的工艺在全球范围内需求巨大。拟议项目的目标是开发概念验证和工作原型,以展示公司的嵌入式电子制造能力。设计和构建具有可再生能源的无线电路(原型)的知识和专业知识将从研究团队转移到公司。圣克莱尔学院的研究人员将受益于应用电子电路知识,并深入了解这个新兴的竞争领域。
英文摘要
Flexible electronics/circuits enable the manufacturing of smaller products and complex circuitry. The ability to embed these flexible circuits into electronic device casings will increase their manufacturing benefits, making this challenging process in great demand globally. The goal of the proposed project is to develop a proof of concept and working prototype to demonstrate the company's embedded electronics manufacturing capabilities. Knowledge and expertise in designing and building the wireless circuit with a renewable energy source (the prototype) will be transferred from the research team to the company. St. Clair College researchers will benefit from applying electronic circuit knowledge and gain insight into this emerging and competitive field.
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