Use of Polishing Process Model as an Example for Manufacturing System Design

在离散制造业中实施技术比在连续过程（例如化学、平板玻璃）和半导体工业中实施技术更困难，在连续过程和半导体工业中，可利用比例定律、单元过程模型和集成系统模型，从而快速实施新技术。 在这项研究中，一种新的方法是开发制造系统建模的详细的物理模型的单元过程，如机械加工和抛光，并将它们集成到一个统一的系统模型。这一发展为离散制造业提供了一条途径，以实现连续过程和半导体行业的许多能力。模型首先开发的一个示例单元过程，即磨料抛光，这是广泛用于生产精密机械和电子元件的光滑表面。 这是通过对抛光力学的实验和理论研究相结合来实现的。 该模型有能力预测抛光过程中的各种输出，如表面光洁度，残余应力和抛光表面上的塑性变形层的深度;和材料去除率。 接下来研究了将单元过程模型的集合集成到整个制造系统的统一模型中的问题。 例如，这就要求将单元操作模型发展到可以提供有关过程差异和这些差异来源的信息的阶段。 这项研究的结果，使一个独特的研讨会课程和短期专着，这将有助于先进的本科生和研究生比较和对比的过程和系统建模问题，在连续过程，离散制造和半导体行业的发展。 ***

9714604 Chandrasekar Technology implementation in the discrete manufacturing sector is more difficult than in the continuous process (e.g. chemical, flat glass) and semiconductor industries, where the availability of scaling laws, unit process models, and integrated system models has allowed for the rapid implementation of new technology. In this study, a new approach is developed for modeling a manufacturing system by starting with detailed physical models of the unit processes, such as machining and polishing, and integrating them into a unified system model. This development illustrates an avenue for the discrete manufacturing industry to achieve many of the capabilities of the continuous process and semiconductor industries. Models are first developed for an example unit process, viz. abrasive polishing, which is widely used to produce smooth surfaces of precision mechanical and electronic components. This is accomplished through a combined experimental and theoretical study of the mechanics of polishing. The models have the capability of predicting various outputs of the polishing process such as surface finish, residual stresses and depth of plastically deformed layers on polished surfaces; and rate of material removal. The problem of integrating a collection of unit process models into a unified model for the entire manufacturing system is next studied. This requires, for example, that unit operation models be developed to a stage where they can provide information about process variances and the sources of these variances. The results of this research enable the development of a unique seminar course and short monograph that will help advanced undergraduate and graduate students to compare and contrast process and system modeling issues in the continuous process, discrete manufacturing and semiconductor industries. ***