Interfacial Creep in Multi-Component Materials Systems

多组分材料系统中的界面蠕变

• 批准号: 0075281
• 负责人: Indranath Dutta
• 金额: $ 13.91万
• 依托单位: Naval Postgraduate School
• 依托单位国家: 美国
• 项目类别: Interagency Agreement
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-06-15 至 2004-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0075281&HistoricalAwards=false
• 关键词: Interfacial; Creep; Multi; Component; Materials

0075281DuttaAlthough interfacial sliding has been noted in many materials systems, a clear mechanistic picture of the phenomenon is yet to emerge. Part of this is associated with the difficulty of designing experiments which allow the strain response of the interface to be distinguished from obfuscating superimposed effects (such as creep of one or both components adjoining the interface). In previous NSF work, it was demonstrated that this challenging task could be accomplished by a combination of carefully designed experimental and analytical approaches. The current research aims to: (1) develop experimental and analytical approaches to study interfacial creep in both bulk and thin film materials systems; (2) develop mechanistic insight into interfacial sliding by correlating the sliding kinetics with the interfacial morphology, structure and chemistry; (3) generate sliding kinetics data for selected interfaces of practical importance, and (4) evaluate the impact of sliding on the performance of two engineering systems of importance (fibrous composites and film-substrate systems). %%%Interfaces between dissimilar materials are critical to the performance of many engineering materials. Often, large shear stresses exist at the interface, and at least one of the materials adjoining the interface can be subjected to high homologous temperatures during service. This enables diffusionally accommodated interfacial sliding (interfacial creep) to occur, with potentially severe impact on the dimensional stability and reliability of the system of interest. Possible examples include metal-matrix composites subjected to thermal cycling, thin-film microelectronic devices subjected to Joule heating during service or thermal cycling during fabrication, and flip-chip solder joints in power electronic packages subjected to thermal excursions during on/off cycles.***

0075281 Dutta尽管在许多材料系统中已经注意到了界面滑动，但是尚未出现该现象的清晰的机械图。这部分是与设计实验的困难有关，这些实验允许将界面的应变响应与混淆的叠加效应（例如邻接界面的一个或两个组件的蠕变）区分开来。在以前的NSF工作中，已经证明了这一具有挑战性的任务可以通过精心设计的实验和分析方法相结合来完成。目前的研究旨在：（1）开发实验和分析方法来研究块状和薄膜材料系统中的界面蠕变;（2）通过将滑动动力学与界面形态、结构和化学相关联来开发对界面滑动的机理洞察;（3）为具有实际重要性的选定界面生成滑动动力学数据，以及（4）评估滑动对两个重要工程系统（纤维复合材料和膜-基底系统）的性能的影响。%不同材料之间的界面对许多工程材料的性能至关重要。通常，在界面处存在大的剪切应力，并且至少一种邻接界面的材料在使用期间可以经受高的同源温度。这使得扩散调节的界面滑动（界面蠕变）发生，对感兴趣的系统的尺寸稳定性和可靠性具有潜在的严重影响。可能的例子包括经受热循环的金属基复合材料、在服务期间经受焦耳加热或在制造期间经受热循环的薄膜微电子器件、以及在开/关循环期间经受热偏移的功率电子封装中的倒装芯片焊点。