EAGER/Collaborative Research: Electromagnetic Pulse Induced Cutting (EPIC) of Metallic Components
EAGER/协作研究:金属部件的电磁脉冲感应切割 (EPIC)
基本信息
- 批准号:1103199
- 负责人:
- 金额:$ 5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2011
- 资助国家:美国
- 起止时间:2011-02-01 至 2012-01-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The research objective of this Early Concept Grant for Exploratory Research (EAGER) award is to demonstrate proof-of-concept of a novel manufacturing process for cutting thin sheet and plates in a tool-less, freeformed fashion. The process, termed Electromagnetic Pulse Induced Cutting, is based on the controlled advance of a fine crack under combined electromagnetic and mechanical loading. The approach will be to utilize electromagnetic forces associated with a series of electric pulses to advance the crack front while using a mechanical load to define the crack direction. In effect, the goal is to move a crack in a highly controlled manner in virtually any direction on a sheet or plate. Conceptually, the process is akin to a microsized, tool-less, electromagnetic jigsaw with a kerf measured in microns. As part of the proposed research, the principles of electromagnetic Lorentz force generation, localized heating at the crack-tip due to current-crowding, and mixed mode fracture mechanics will be combined to derive the conditions required to advance and turn the crack using a simple experimental prototype.If successful, the benefit to society of the research will include the emergence of a new manufacturing process for precision-cutting of mesoscale thin sheets and foils of brittle, hard-to-process materials. As such, the process has the potential to serve as a new enabling technology for the nation?s manufacturing base. In addition, this project will integrate research and education by advancing discovery and understanding by graduate students at two American universities.
该早期概念探索性研究资助 (EAGER) 奖项的研究目标是展示一种以无工具、自由形状方式切割薄板和板材的新颖制造工艺的概念验证。 该工艺称为电磁脉冲诱导切割,基于电磁和机械载荷组合下细裂纹的受控前进。 该方法将利用与一系列电脉冲相关的电磁力来推进裂纹前沿,同时使用机械载荷来定义裂纹方向。 实际上,目标是以高度受控的方式在板材或板材上的几乎任何方向上移动裂纹。 从概念上讲,该过程类似于微型、免工具的电磁竖锯,其切口以微米为单位。 作为拟议研究的一部分,电磁洛伦兹力产生的原理、由于电流拥挤而导致裂纹尖端的局部加热以及混合模式断裂力学将被结合起来,以使用简单的实验原型导出推进和扭转裂纹所需的条件。如果成功,该研究对社会的好处将包括出现一种用于精确切割脆性介观薄片和箔片的新制造工艺, 难加工材料。因此,该工艺有潜力成为国家制造基地的一项新的支持技术。 此外,该项目将通过促进两所美国大学研究生的发现和理解来整合研究和教育。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Indranath Dutta其他文献
Microstructurally Adaptive Model for Evolution of Creep Due to Aging in SnAgCu Solder Alloys
- DOI:
10.1007/s11664-024-11701-w - 发表时间:
2025-01-06 - 期刊:
- 影响因子:2.500
- 作者:
Sri Chaitra Chavali;Sai Sanjit Ganti;Yuvraj Singh;Ganesh Subbarayan;Indranath Dutta;Mysore Dayananda - 通讯作者:
Mysore Dayananda
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions
- DOI:
10.1007/s11664-007-0316-0 - 发表时间:
2007-10-30 - 期刊:
- 影响因子:2.500
- 作者:
Xin Long;Indranath Dutta;Vijay Sarihan;Darrel R. Frear - 通讯作者:
Darrel R. Frear
Creep in multi-component materials systems
- DOI:
10.1007/s11837-003-0186-8 - 发表时间:
2003-01-01 - 期刊:
- 影响因子:2.300
- 作者:
Indranath Dutta - 通讯作者:
Indranath Dutta
Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration
- DOI:
10.1007/s11664-023-10845-5 - 发表时间:
2023-12-13 - 期刊:
- 影响因子:2.500
- 作者:
Tae-kyu Lee;Hanry Yang;Indranath Dutta - 通讯作者:
Indranath Dutta
Indranath Dutta的其他文献
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{{ truncateString('Indranath Dutta', 18)}}的其他基金
Collaborative Research: Mechanisms and Processing Strategies for Sn Whisker Mitigation
合作研究:锡晶须缓解机制和加工策略
- 批准号:
1335491 - 财政年份:2013
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Influence of Electric Field and Stress on Diffusional Sliding at Hetero-Interfaces
电场和应力对异质界面扩散滑动的影响
- 批准号:
1309843 - 财政年份:2013
- 资助金额:
$ 5万 - 项目类别:
Continuing Grant
Collaborative Research: Electromagnetic Pulse Cutting of Metallic Components
合作研究:金属部件的电磁脉冲切割
- 批准号:
1232458 - 财政年份:2012
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
A Breakthrough Nanolithography Technique Using 'Electro-Fountain Pens'
使用“电子钢笔”的突破性纳米光刻技术
- 批准号:
1100900 - 财政年份:2011
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
EAGER: Fracture of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions
EAGER:微电子无铅焊点在动态负载条件下断裂
- 批准号:
0939392 - 财政年份:2009
- 资助金额:
$ 5万 - 项目类别:
Continuing Grant
GOALI: Effects of Processing and Microstructure on the Fracture Properties of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions
目标:加工和微观结构对动态负载条件下微电子无铅焊点断裂性能的影响
- 批准号:
0705734 - 财政年份:2007
- 资助金额:
$ 5万 - 项目类别:
Interagency Agreement
Interfacial Creep in Thin Film Interconnect Structures in Micro-Systems
微系统中薄膜互连结构的界面蠕变
- 批准号:
0513874 - 财政年份:2005
- 资助金额:
$ 5万 - 项目类别:
Continuing Grant
GOALI: Creep and Microstructural Coarsening of Lead-Free Solders in Micro-Electronic Packaging Applications
GOALI:微电子封装应用中无铅焊料的蠕变和微观结构粗化
- 批准号:
0209464 - 财政年份:2002
- 资助金额:
$ 5万 - 项目类别:
Interagency Agreement
Interfacial Creep in Multi-Component Materials Systems
多组分材料系统中的界面蠕变
- 批准号:
0075281 - 财政年份:2000
- 资助金额:
$ 5万 - 项目类别:
Interagency Agreement
An Analytical and Experimental Study of Longitudinal Creep in Countinous Fiber Composites
无数纤维复合材料纵向蠕变的分析与实验研究
- 批准号:
9423668 - 财政年份:1995
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
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