Collaborative Research: Electromagnetic Pulse Cutting of Metallic Components

合作研究:金属部件的电磁脉冲切割

基本信息

  • 批准号:
    1232458
  • 负责人:
  • 金额:
    $ 17.65万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2012
  • 资助国家:
    美国
  • 起止时间:
    2012-08-01 至 2016-07-31
  • 项目状态:
    已结题

项目摘要

The objective of this award is to research novel electromagnetic cutting techniques for freeformed fabrication of shaped parts from thin metallic sheet and plates with and without mechanical assistance. The processes, termed Electromagnetic Pulse Induced Cutting and Non-Contact Magnetic Cutting, are based on the controlled advance of a fine crack under an electromagnetic and in one case combined mechanical loading. Conceptually, the processes are akin to a microsized, electromagnetic jigsaw with a kerf measured in microns. The approach is (a) to develop a theoretical basis for fracture mechanics under combined mechanical and electromagnetic forces through a combination of modeling and experiment, (b) to experimentally optimize the conditions for controlled electromagnetically driven crack extension, with and without simultaneous mechanical loading and active sample cooling, and (c) to develop experimental testbeds for demonstrating electromechanical driven freeform metal cutting. If successful, the benefits of this research will include increased understanding of the nature of the electromechanical cutting processes culminating in creation of laboratory demonstration testbeds and leading eventually to technology transfer and commercialization; education of undergraduate and graduate students; and dissemination of results. The results of the proposed research will impact domestic competition by providing novel manufacturing processes for commercialization. Several undergraduate students will assist in the research funded by associated Research Experience for Undergraduates grants at both universities. Under-represented minority undergraduates will be hired who show strong potential for graduate pursuits. Results of the project will be broadly disseminated to enhance specific and technological understanding. This will be done both through faculty and student participation at meetings of learned societies and the National Science Foundation Division of Civil, Mechanical and Manufacturing Innovation Grantees Conferences.
该奖项的目的是研究新的电磁切割技术,用于在有或没有机械辅助的情况下从薄金属板和板材自由成形制造成型零件。该过程被称为电磁脉冲感应切割和非接触式磁性切割,是基于电磁载荷和在一种情况下组合的机械载荷下的细裂纹的受控前进。从概念上讲,这些过程类似于一个微型的电磁拼图,切口以微米为单位。该方法是(a)通过建模和实验相结合,开发机械力和电磁力联合作用下的断裂力学的理论基础,(B)在实验上优化受控电磁驱动裂纹扩展的条件,同时具有和不具有机械载荷和主动样品冷却,以及(c)开发用于演示机电驱动自由金属切割的实验测试台。如果成功的话,这项研究的好处将包括增加对机电切割过程的性质的理解,最终建立实验室示范试验台,并最终导致技术转让和商业化;本科生和研究生的教育;以及结果的传播。拟议研究的结果将通过提供商业化的新制造工艺来影响国内竞争。一些本科生将协助在两所大学的本科生赠款相关的研究经验资助的研究。代表性不足的少数民族本科生将被雇用谁表现出强大的研究生追求的潜力。将广泛传播该项目的成果,以增进对具体问题和技术问题的了解。这将通过教师和学生参加学术团体会议和国家科学基金会土木,机械和制造业创新资助者会议。

项目成果

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Indranath Dutta其他文献

Microstructurally Adaptive Model for Evolution of Creep Due to Aging in SnAgCu Solder Alloys
  • DOI:
    10.1007/s11664-024-11701-w
  • 发表时间:
    2025-01-06
  • 期刊:
  • 影响因子:
    2.500
  • 作者:
    Sri Chaitra Chavali;Sai Sanjit Ganti;Yuvraj Singh;Ganesh Subbarayan;Indranath Dutta;Mysore Dayananda
  • 通讯作者:
    Mysore Dayananda
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions
  • DOI:
    10.1007/s11664-007-0316-0
  • 发表时间:
    2007-10-30
  • 期刊:
  • 影响因子:
    2.500
  • 作者:
    Xin Long;Indranath Dutta;Vijay Sarihan;Darrel R. Frear
  • 通讯作者:
    Darrel R. Frear
Creep in multi-component materials systems
  • DOI:
    10.1007/s11837-003-0186-8
  • 发表时间:
    2003-01-01
  • 期刊:
  • 影响因子:
    2.300
  • 作者:
    Indranath Dutta
  • 通讯作者:
    Indranath Dutta
Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration
  • DOI:
    10.1007/s11664-023-10845-5
  • 发表时间:
    2023-12-13
  • 期刊:
  • 影响因子:
    2.500
  • 作者:
    Tae-kyu Lee;Hanry Yang;Indranath Dutta
  • 通讯作者:
    Indranath Dutta

Indranath Dutta的其他文献

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{{ truncateString('Indranath Dutta', 18)}}的其他基金

Collaborative Research: Mechanisms and Processing Strategies for Sn Whisker Mitigation
合作研究:锡晶须缓解机制和加工策略
  • 批准号:
    1335491
  • 财政年份:
    2013
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Standard Grant
Influence of Electric Field and Stress on Diffusional Sliding at Hetero-Interfaces
电场和应力对异质界面扩散滑动的影响
  • 批准号:
    1309843
  • 财政年份:
    2013
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Continuing Grant
A Breakthrough Nanolithography Technique Using 'Electro-Fountain Pens'
使用“电子钢笔”的突破性纳米光刻技术
  • 批准号:
    1100900
  • 财政年份:
    2011
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Standard Grant
EAGER/Collaborative Research: Electromagnetic Pulse Induced Cutting (EPIC) of Metallic Components
EAGER/协作研究:金属部件的电磁脉冲感应切割 (EPIC)
  • 批准号:
    1103199
  • 财政年份:
    2011
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Standard Grant
EAGER: Fracture of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions
EAGER:微电子无铅焊点在动态负载条件下断裂
  • 批准号:
    0939392
  • 财政年份:
    2009
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Continuing Grant
GOALI: Effects of Processing and Microstructure on the Fracture Properties of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions
目标:加工和微观结构对动态负载条件下微电子无铅焊点断裂性能的影响
  • 批准号:
    0705734
  • 财政年份:
    2007
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Interagency Agreement
Interfacial Creep in Thin Film Interconnect Structures in Micro-Systems
微系统中薄膜互连结构的界面蠕变
  • 批准号:
    0513874
  • 财政年份:
    2005
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Continuing Grant
GOALI: Creep and Microstructural Coarsening of Lead-Free Solders in Micro-Electronic Packaging Applications
GOALI:微电子封装应用中无铅焊料的蠕变和微观结构粗化
  • 批准号:
    0209464
  • 财政年份:
    2002
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Interagency Agreement
Interfacial Creep in Multi-Component Materials Systems
多组分材料系统中的界面蠕变
  • 批准号:
    0075281
  • 财政年份:
    2000
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Interagency Agreement
An Analytical and Experimental Study of Longitudinal Creep in Countinous Fiber Composites
无数纤维复合材料纵向蠕变的分析与实验研究
  • 批准号:
    9423668
  • 财政年份:
    1995
  • 资助金额:
    $ 17.65万
  • 项目类别:
    Standard Grant

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