Interfacial Creep in Thin Film Interconnect Structures in Micro-Systems

微系统中薄膜互连结构的界面蠕变

• 批准号: 0513874
• 负责人: Indranath Dutta
• 金额: $ 40.07万
• 依托单位: Naval Postgraduate School
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-08-15 至 2011-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0513874&HistoricalAwards=false
• 关键词: Interfacial; Creep; Thin; Film; Interconnect

TECHNICAL In many applications of multi-component micro-systems, interfaces are subjected to large shear stresses and high homologous temperatures. This enables diffusionally accommodated sliding processes (interfacial creep) to operate at the interface. Furthermore, thin film interconnect structures in micro-systems often carry large electric current densities, which drive electromigration. As interconnect dimensions shrink, interfaces become the primary path for diffusion during electromigration, potentially leading to significant interactions between interfacial diffusive fluxes due to applied stress and electromigration. With the emerging trend towards nano-scale miniaturization of multi-material assemblies in microelectronics, MEMS and functional nano-composites, and the commensurately explosive growth in interfacial area inside these assemblies, interfacial sliding is likely to become increasingly prominent, severely impacting the performance and reliability of the component. Here, a comprehensive experimental and analytical effort is proposed in order to obtain fundamental mechanistic insight into interfacial creep at thin film-substrate interfaces under thermomechanical and electrical loads. The effort will combine creep testing with and without applied electrical current, interfacial characterization, constitutive modeling and experimental/analytical investigations of microelectronic device structures. This study will highlight the interaction between stress and electric current in promoting/inhibiting interfacial sliding. NON-TECHNICAL: The broader impact of the work is related to its technological relevance to the entire micro/nano-systems industry by bringing to light a new phenomenon which may become performance limiting in a wide array of components in the future. Throughout the project, the PI and his group will work closely with the industry to identify/address issues of emerging relevance, and expose students to the industry. In addition to training graduate students and post-docs, the PI and his group will work with high school students through a local enrichment program to expose them to materials research and emerging issues related to micro/nano-systems. Summer internships will also be offered to middle/high school science teachers with the aim of helping them develop lesson modules relevant to the general area of this research.

技术在多组分微系统的许多应用中，界面受到大的剪切应力和高的同源温度。这使得扩散调节滑动过程（界面蠕变）在界面处操作。此外，微系统中的薄膜互连结构通常承载大电流密度，这驱动电迁移。随着互连尺寸的缩小，界面成为电迁移期间扩散的主要路径，可能导致由于施加的应力和电迁移引起的界面扩散通量之间的显著相互作用。随着微电子、MEMS和功能纳米复合材料中多材料组件的纳米级小型化趋势以及这些组件内部界面面积的爆炸性增长，界面滑动可能变得越来越突出，严重影响组件的性能和可靠性。在这里，提出了一个全面的实验和分析工作，以获得基本的机械洞察下的热机械和电气负载的薄膜-基板界面的界面蠕变。这项工作将结合联合收割机蠕变测试和不施加电流，界面特性，本构建模和微电子器件结构的实验/分析研究。这项研究将突出应力和电流在促进/抑制界面滑动之间的相互作用。非技术性：这项工作的更广泛的影响与其对整个微/纳米系统行业的技术相关性有关，因为它揭示了一种新的现象，这种现象可能会在未来限制各种组件的性能。在整个项目中，PI和他的团队将与行业密切合作，以确定/解决新出现的相关问题，并让学生接触行业。除了培训研究生和博士后，PI和他的团队还将通过当地的丰富计划与高中生合作，让他们接触材料研究和与微/纳米系统相关的新兴问题。还将向初中/高中科学教师提供暑期实习机会，以帮助他们开发与本研究一般领域相关的课程模块。