SGER: Simulation-Based Design and Prototype Testing of a Programmable Chemical Vapor Deposition Reactor

摘要- Adomaitis - 0085633一个探索性的研究计划，计划设计一个化学气相沉积（CVD）反应器，将使整个晶圆空间控制的沉积特性。 现有的CVD反应器将被修改，并用于生成数据，用于开发反应器设计和操作的详细模拟器。 目标是评估这种可编程反应器的驱动能力，并建立其过程模拟，优化，传感和控制要求。 具体任务包括：（1）证明CVD反应器设计的新概念，该概念将展示空间可控的反应物输送到晶片：这将使整个晶片的均匀性能够在材料性能或制造产量所需的几乎任何工艺设计点实现。 它还将允许有意的、编程的非均匀性，以减少工艺开发的成本和时间。(2)为可编程CVD反应器系统开发面向对象的基于仿真的设计、分析、优化和过程控制工具。(3)建立下一代CVD反应器的原型，用于材料开发环境中进行组合CVD研究，以快速评估新工艺和材料。(4)展示了半导体加工设备设计中的一个概念，该概念可以扩展到其他重要的制造工艺，包括等离子体增强CVD，反应离子蚀刻，以及可能的液相工艺，如晶片清洗和电镀。

Abstract - Adomaitis - 0085633 An exploratory research program is planned to design a chemical vapor deposition (CVD) reactor that will enable across-wafer spatial control of deposition characteristics. An existing CVD reactor will be modified and used to generate data for developing a detailed simulator for reactor design and operation. The goals are to evaluate the actuation capabilities of this programmable reactor and establish its process simulation, optimization, sensing, and control requirements. The research is expected to demonstrate proof of concept for an entirely new mode of CVD processing.Specific tasks will include:(1) Proving a new concept for CVD reactor design that will demonstrate spatially controllable reactant delivery to the wafer: This will enable across-wafer uniformity to be achieved at virtually any process design point desired for material performance or manufacturing throughput. It will also allow intentional, programmed non-uniformity to reduce cost and time in process development.(2) Developing object-oriented simulation-based design, analysis, optimization, and process control tools for the programmable CVD reactor system.(3) Establishing a prototype for the next generation of CVD reactors for use in a materials development environment for conducting combinatorial CVD studies to rapidly evaluate new processes and materials.(4) Demonstrating a concept in semiconductor processing equipment design that can be extended to other important manufacturing processes, including plasma-enhanced CVD, reactive ion etching, and possibly liquid-phase processes such as wafer cleaning and plating.