CAREER: High-Temperature Thermal Transport in LPCVD Polysilicon for MEMS

职业：MEMS LPCVD 多晶硅中的高温热传输

• 批准号: 0092716
• 负责人: Katsuo Kurabayashi
• 金额: $ 37.5万
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-01-01 至 2005-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0092716&HistoricalAwards=false
• 关键词: CAREER; Temperature; Thermal; Transport; LPCVD

This research program investigates the impact of high-temperature microstructural changes in Low Pressure Chemical Vapor Deposited (LPCVD) polysilicon on microscale thermal transport phenomena in microelectromechanical systems (MEMS). An application of thermal conduction physics, materials science, and silicon micromachining is made for generating new scientific knowledge needed for the design of polysilicon-based thermal sensors and actuators, and for their reliability predictions. To achieve studies at high-temperatures, a novel on-chip instrument is developed using MEMS techniques. The instrument is to measure thermal transport property of polysilicon films and allows for in situ observation of grain size evolution. Based on the acquired experimental data, theoretical work is performed to model thermal transport by accounting for grain size, grain configuration, impurity concentrations, and microstructural kinetics. The developed model is to serve for understanding scaling laws and design rules for polysilicon-based MEMS devices and CMOS transistors. The education program addresses the significant demands on heat transfer education for MEMS engineers with the purpose of preparing students for "optimizing a product design." Using on-campus information technology resources, this program develops a new heat transfer course based on a MEMS thermal design competition. The thermal design project asks student teams to propose a MEMS design that should yield a better figure of merit for a particular device, which is strongly influenced by heat transfer phenomena. The course is designed for senior and graduate students from various engineering programs. A web-page-based instruction is implemented for this course to promote effective communications among the participants.

本研究计划探讨了低压化学气相沉积（LPCVD）多晶硅中高温微结构变化对微机电系统（MEMS）中微尺度热输运现象的影响。 热传导物理学，材料科学和硅微机械加工的应用是产生新的科学知识所需的多晶硅为基础的热传感器和执行器的设计，并为他们的可靠性预测。为了实现高温下的研究，采用MEMS技术开发了一种新型的片上仪器。 该仪器是用来测量多晶硅薄膜的热输运性质，并允许在原位观察晶粒尺寸的演变。 基于所获得的实验数据，进行理论工作，通过考虑晶粒尺寸，晶粒结构，杂质浓度和微观结构动力学来模拟热传输。 所开发的模型是为理解基于多晶硅的MEMS器件和CMOS晶体管的比例律和设计规则。该教育计划解决了MEMS工程师对传热教育的重大需求，旨在为学生“优化产品设计”做好准备。“利用校园内的信息技术资源，该计划开发了一个新的传热课程的基础上MEMS热设计比赛。 热设计项目要求学生团队提出一种MEMS设计，该设计应该为特定设备产生更好的品质因数，该设备受到传热现象的强烈影响。 该课程是专为高年级和研究生从各种工程项目。 本课程采用网页教学，以促进学员之间的有效沟通。