CAREER: Systematic Multiscale Modeling of Directed Assembly in Semiconductor Materials Processing

摘要提案编号：CTS-0134418首席研究员：Talid Sinno所属单位：宾夕法尼亚大学提案标题：CAREER：半导体材料加工中定向组装的系统多尺度建模PI建议开发一个协同建模框架，从连续水平到原子模拟，以提高对电子材料加工过程中扩散反应和物种聚集的理解。 创造新的结构，在长度尺度小于那些可从传统的自上而下的制造方法，需要一个详细的原子的物理和化学多组分工艺的理解。 这种理解也必须与宏观尺度的工艺操作条件相联系。 可以从这种范例中受益的潜在应用领域包括硅微电子中的体掺杂剂和缺陷分布的原子尺度控制，其他电子材料（例如SiC、SiGe和GaAs）中的缺陷控制，以及先进光电材料的多层结构的受控沉积。 分析框架与现有实验结果的紧密耦合将包括在研究计划中。 该项目教育部分的主要目标是将电子材料加工引入化学工程专业的课程选择中，特别是在宾夕法尼亚大学，以增加进入这一重要行业的毕业生人数。

AbstractProposal Number: CTS-0134418Principal Investigator: Talid SinnoAffiliation: University of PennsylvaniaProposal Title: CAREER: Systematic Multiscale Modeling of Directed Assembly in Semiconductor Materials ProcessingThe PI proposes to develop a synergistic modeling framework, from continuum level through atomistic simulation, to improve the understanding of diffusion reaction, and species aggregation during electronic materials processing. The creation of novel structures at length scales smaller than those available from traditional top-down fabrication methods requires a detailed atomistic understanding of the physics and chemistry governing multicomponent processes. This understanding must be linked also to macroscopic scale process operating conditions. Potential application areas that can benefit from such a paradigm include atomistic scale control of bulk dopant and defect distribution in silicon microelectronics, defect control in other electronic materials such as SiC, SiGe, and GaAs, and controlled deposition of multilayered structures for advanced optoelectronic materials. A close coupling of the analytical framework against available experimental results will be included in the research program. A primary goal of the educational component of the project will be to introduce electronic materials processing into the curriculum choices for chemical engineering majors, particularly at the University of Pennsylvania, to increase the number of those graduates who move into this important industry.