CAREER: Systematic Multiscale Modeling of Directed Assembly in Semiconductor Materials Processing

摘要项目编号：csts -0134418项目负责人：Talid sina隶属于美国宾夕法尼亚大学项目名称：半导体材料加工中定向组装的系统多尺度建模。项目建议开发一个从连续体水平到原子模拟的协同建模框架，以提高对电子材料加工过程中扩散反应和物质聚集的理解。创建比传统自上而下的制造方法更小的长度尺度的新结构需要对控制多组分过程的物理和化学的详细原子理解。这种理解还必须与宏观规模的工艺操作条件联系起来。可以从这种范例中受益的潜在应用领域包括硅微电子中大块掺杂剂和缺陷分布的原子尺度控制，其他电子材料（如SiC， SiGe和GaAs）的缺陷控制，以及先进光电材料多层结构的控制沉积。分析框架与现有实验结果的紧密耦合将包括在研究计划中。该项目的教育部分的一个主要目标是将电子材料加工引入化学工程专业的课程选择中，特别是在宾夕法尼亚大学，以增加进入这一重要行业的毕业生人数。

AbstractProposal Number: CTS-0134418Principal Investigator: Talid SinnoAffiliation: University of PennsylvaniaProposal Title: CAREER: Systematic Multiscale Modeling of Directed Assembly in Semiconductor Materials ProcessingThe PI proposes to develop a synergistic modeling framework, from continuum level through atomistic simulation, to improve the understanding of diffusion reaction, and species aggregation during electronic materials processing. The creation of novel structures at length scales smaller than those available from traditional top-down fabrication methods requires a detailed atomistic understanding of the physics and chemistry governing multicomponent processes. This understanding must be linked also to macroscopic scale process operating conditions. Potential application areas that can benefit from such a paradigm include atomistic scale control of bulk dopant and defect distribution in silicon microelectronics, defect control in other electronic materials such as SiC, SiGe, and GaAs, and controlled deposition of multilayered structures for advanced optoelectronic materials. A close coupling of the analytical framework against available experimental results will be included in the research program. A primary goal of the educational component of the project will be to introduce electronic materials processing into the curriculum choices for chemical engineering majors, particularly at the University of Pennsylvania, to increase the number of those graduates who move into this important industry.