Alternative Chemistries for Barrier Materials in Cu Metallization

佛罗里达大学化学系的Lisa McElwee-White、化学工程系的Timothy J.Anderson、材料科学与工程系的David P.Norton、韩国成均馆大学的Intel Corporation、Sung Min Cho和佛罗里达大学材料科学与工程系的Karin Pruessner得到了化学合作研究计划的奖励，资金来自化学系、物理系、分子、细胞生物学和多学科活动办公室。这个多方面的团队将研究新的扩散阻挡材料，这种材料在未来几代集成电路中对铜的扩散比氮化钛更稳定。这一合作项目涉及为金属-有机化学气相沉积(MOCVD)和原子层沉积(ALD)制备WNx的单一来源前体，然后是前体的筛选、CVD和ALD生长研究，以及沉积材料的表征。对MOCVD和物理气相沉积(PVD)WNx薄膜的微结构和铜扩散的比较研究将有助于评估它们在势垒应用中的潜力。电子工业中的一个关键问题，即开发合适的抗铜扩散的势垒材料和在高深宽比通孔中沉积铜的方法，将采用多学科的方法进行研究。这种合作结合了前驱体化学开发、沉积工艺改进、材料表征、计算模拟和器件制造。除了新材料外，调查人员还将调查WNx。学生和博士后助理将接触到团队培训和解决问题的技能，这些技能超出了他们自己的研究生学习学科。此外，与英特尔的互动将拓宽他们的视野，超越学术研究。这种合作有着反映当地人口的多样性历史。开发教育单元和向8-12年级女孩推广等活动将鼓励其他人参与相关的科学领域。

Lisa McElwee-White, Department of Chemistry, Timothy J. Anderson, Department of Chemical Engineering, David P. Norton, Department of Materials Science and Engineering, all of the University of Florida, in collaboration with Steven W. Johnston, Intel Corporation, Sung Min Cho, Sungkyunkwan University, Korea, and Karin Pruessner, Materials Science and Engineering, University of Florida are funded with an award from the Collaborative Research in Chemistry Program with funds provided by the Division of Chemistry, the Division of Physics, the Division of Molecular, Cellular Biology and the Office of Multidisciplinary Activities. This multifaceted team will investigate newdiffusion barrier materials that are more stable toward copper diffusion than titanium nitride for future generations of integrated circuits. This collaborative project involves preparation of single source precursors for metal-organic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD) of WNx followed by screening of the precursors, CVD and ALD growth studies, and characterization of the deposited material. Comparative studies of microstructure and Cu diffusion in MOCVD and physical vapor deposition (PVD) WNx films will allow evaluation of their potential in barrier applications.A critical problem in the electronics industry, development of a suitable barrier material against Cu diffusion and a method of depositing it in high aspect ratio vias, will be investigated using a multidisciplinary approach This collaboration connects precursor chemistry development, deposition process refinement, materials characterization, computational modeling and device fabrication. The investigators will investigate WNx in addition to new materials. Students and postdoctoral associates will gain exposure to team-based training and problem solving skills that reach outside their own disciplines of graduate study. In addition, the interaction with Intel will broaden their perspectives beyond academic research. This collaboration has a history of diversity that reflects the local population. Activities such as educational module development and outreach to grade 8-12 girls will encourage participation by others in related areas of science.