FOR 1522: Multi-physical Synthesis and Integration of Complex Radio Frequency Circuits - MUSIK

FOR 1522：复杂射频电路的多物理综合和集成 - MUSIC

• 批准号: 169536409
• 金额: --
• 依托单位: IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gGmbH
• 依托单位国家: 德国
• 项目类别: Research Units
• 财政年份: 2012
• 资助国家: 德国
• 起止时间: 2011-12-31 至 2018-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/169536409?language=en
• 关键词: 1522; Multi; physical; Synthesis; Integration

The key constituents of micro-electromechanical systems (MEMS) are mechanically flexible devices on the micrometre scale, where the mechanical motions can be excited and detected by electrical signals. The Research Unit aims at including the basic functions of MEMS at high frequencies, such as amplifying, controlling, oscillating and switching, into the design of complex radio frequency (RF) circuits. Through the combination of micro-electronic and micro-mechanic properties at device, circuit and system levels, a novel circuit technology "RF micromechatronics" is made accessible. As a consequence, the research focus on RF-MEMS is steered from the technology and single-device levels to an application-oriented system level, e.g., for mobile communications. Resulting from the cooperation of researchers from different scientific disciplines, a core approach of the Research Unit is the multi-physical modelling and simulation, which explicitly accounts for the coupled electric and mechanic properties of MEMS in relation to their mathematical description as well as the physically different effects of electronic and mechanic functions, including their unwanted and wanted parasictics. This fundamental approach is accompanied by a substrate technology tailored to the simultaneous implementation of micro-electronic and micro-mechanic devices, namely by merging silicon and ceramic technologies into a novel compound substrate (SiCer). Only this approach, originally investigated at the IMN MicroNano® at Ilmenau University of Technology, enables a consequent implementation of micro-electromechanical RF circuit technology. The following objectives are jointly addressed, investigated in complementary sub-projects and verified respectively demonstrated jointly: Model and system design and system analysis of complex RF circuits; integrated micro-electronic-micro-electromechanic RF components and circuits; system simulation and integration analysis of non-ideal RF MEMS; simulations and tests crossing multiple abstraction levels; micro-mechanic and micro-electronic integration in SiCer substrate technology; demonstration of the approach in terms of selected subsystems.

微机电系统（MEMS）的关键组成部分是微米级的机械柔性器件，其中机械运动可以由电信号激励和检测。该研究单元旨在将MEMS在高频的基本功能，如放大，控制，振荡和开关，纳入复杂的射频（RF）电路的设计中。通过在器件级、电路级和系统级结合微电子和微机械特性，一种新的电路技术“RF微机电一体化”成为可能。因此，RF-MEMS的研究重点从技术和单器件水平转向面向应用的系统水平，例如，用于移动的通信。由于来自不同科学学科的研究人员的合作，研究单位的核心方法是多物理建模和仿真，它明确说明了MEMS的耦合电气和机械特性与其数学描述以及电子和机械功能的物理不同影响，包括他们不想要的和想要的寄生虫。这种基本方法伴随着一种基板技术，该技术适合于同时实现微电子和微机械器件，即通过将硅和陶瓷技术合并到一种新型复合基板（SiCer）中。只有这种最初在伊尔梅瑙理工大学IMN MicroNano®研究的方法，才能实现微机电RF电路技术的后续实施。以下目标是共同解决的，在互补的子项目中进行了研究，并分别进行了验证和演示：复杂RF电路的模型和系统设计与系统分析;集成微电子-微机电RF元件和电路;非理想RF MEMS的系统仿真和集成分析;跨多个抽象层次的仿真和测试;微机械和微电子集成在硅铈衬底技术;示范的方法，在选定的子系统。