Scaling Limits of Programmable Fluidic Self-Assembly Forming Electrical Interconnects

本研究的目的是开发一种工艺，以并行方式跨长度尺度和材料边界集成功能半导体器件。第一个目标是使芯片级自组装（目前与毫米大小的组件）在100 nm的-V 50？100米长的尺度。第二个目标是开发一种组装组件的工艺，具有单一角度取向的微/纳米芯片，以实现具有接触焊盘对准的“纳米倒装芯片组装”。该方法利用表面张力来指导自组装过程。智力优点考虑到串行机器人拾取和放置，组件的数量级小于当前最先进的水平。 在更广泛的意义上，将任意材料和设备定位在任意衬底上的能力允许基于其他不兼容材料的技术的合并。应用包括灵活的高性能电子产品，太阳能电池和传感器系统，以收集光学，声学，化学和/或放射性数据，这些数据将改善我们日常生活的许多领域，包括医疗保健，环境，能源，食品安全，制造业和国家安全。 更广泛的影响拟议的努力将导致本科生研讨会的发展。 本科生也将通过荣誉论文项目参与研究，并通过REU和UROP的机会。 PI还与明尼苏达州的科学博物馆合作。

ObjectiveThe objective of this research is to develop a process to integrate functional semiconducting devices across length scales and material boundaries in a parallel manner. The first objective is to enable chip level self-assembly (currently performed with mm-sized components) at the 100 nm ¡V 50 ?Ým length scale. The second objective is to develop a process to assemble components, micro/nanochips with single angular orientation to enable ¡§Nano-Flip-Chip-Assembly¡¨ with contact pad registration. The approach utilizes surface tension to direct the self-assembly process. Intellectual MeritThe components are orders of magnitude smaller than current state of the art considering serial robotic pick and place. In a broader sense, the ability to localize arbitrary materials and devices on arbitrary substrates allows the merging of technologies based on otherwise incompatible materials. Applications include flexible high performance electronics, solar cells, and sensor systems to gather optical, acoustic, chemical, and/or radiological data that would improve many areas of our daily lives including healthcare, the environment, energy, food safety, manufacturing, and national security. Broader ImpactThe proposed effort will lead to the development of seminars for undergraduate students. Undergraduate students will also be involved in the research through an honors thesis project, and through REU and UROP opportunities. The PI is also engaged with the Science Museum in Minnesota.