Scaling Limits of Programmable Fluidic Self-Assembly Forming Electrical Interconnects

可编程流体自组装形成电气互连的规模限制

• 批准号: 0822202
• 负责人: Heiko Jacobs
• 金额: $ 30万
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-08-01 至 2013-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0822202&HistoricalAwards=false
• 关键词: Scaling; Limits; Programmable; Fluidic; Self

ObjectiveThe objective of this research is to develop a process to integrate functional semiconducting devices across length scales and material boundaries in a parallel manner. The first objective is to enable chip level self-assembly (currently performed with mm-sized components) at the 100 nm ¡V 50 ?Ým length scale. The second objective is to develop a process to assemble components, micro/nanochips with single angular orientation to enable ¡§Nano-Flip-Chip-Assembly¡¨ with contact pad registration. The approach utilizes surface tension to direct the self-assembly process. Intellectual MeritThe components are orders of magnitude smaller than current state of the art considering serial robotic pick and place. In a broader sense, the ability to localize arbitrary materials and devices on arbitrary substrates allows the merging of technologies based on otherwise incompatible materials. Applications include flexible high performance electronics, solar cells, and sensor systems to gather optical, acoustic, chemical, and/or radiological data that would improve many areas of our daily lives including healthcare, the environment, energy, food safety, manufacturing, and national security. Broader ImpactThe proposed effort will lead to the development of seminars for undergraduate students. Undergraduate students will also be involved in the research through an honors thesis project, and through REU and UROP opportunities. The PI is also engaged with the Science Museum in Minnesota.

本研究的目的是开发一种在长度尺度和材料边界之间以并行方式集成功能半导体器件的工艺。第一个目标是实现芯片级自组装(目前使用毫米尺寸的元件)，长度为100 nm×50？m。第二个目标是开发一种组装组件的工艺，即具有单一角度取向的微/纳米芯片，以实现具有接触焊盘对准的“纳米倒装芯片组装”。该方法利用表面张力来指导自组装过程。智能优点考虑到串联机器人的拾取和放置，这些部件比目前的技术水平小几个数量级。在更广泛的意义上，在任意衬底上定位任意材料和设备的能力允许基于其他不兼容材料的技术合并。应用包括灵活的高性能电子、太阳能电池和传感器系统，以收集光学、声学、化学和/或放射数据，这些数据将改善我们日常生活的许多领域，包括医疗保健、环境、能源、食品安全、制造和国家安全。更广泛的影响拟议的努力将导致为本科生开发研讨会。本科生还将通过荣誉论文项目以及REU和UROP机会参与研究。PI还与明尼苏达州的科学博物馆进行了接触。