Universal Chip Assembly and Interconnection Process - Development and Applications

通用芯片组装和互连工艺 - 开发和应用

• 批准号: 1068013
• 负责人: Heiko Jacobs
• 金额: $ 36万
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-05-01 至 2016-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1068013&HistoricalAwards=false
• 关键词: Universal; Chip; Assembly; Interconnection; Process

The objective of this research is to develop a process to assemble and interconnect functional semiconducting devices across length scales and material boundaries in a massively parallel manner. The goals are to reduce the minimal component size far beyond current levels while supporting the ability to from electrical interconnects between the assembled structures. The approach is based on self-assembly instead of robotic pick and place. The intellectual merit of this research is to establish a knowledge base that will enable the engineering of self-assembly processes. This requires development of a comprehensive understanding of the forces that can be used and of the environments that are necessary to direct the assembly process.Broader impacts: The ability to assemble and interconnect materials and devices on arbitrary substrates allows the merging of technologies based on otherwise incompatible materials. Applications include flexible high performance electronics, solar cells, and sensor systems to gather optical, acoustic, chemical, and/or radiological data that would improve many areas of our daily lives including healthcare, the environment, energy, food safety, manufacturing, and national security. The research effort and new knowledge base will lead to the development of seminars and course materials, which will impact graduate and advanced undergraduate students beyond those that are directly involved in the research.

本研究的目的是开发一种以大规模平行方式跨长度尺度和材料边界组装和互连功能半导体器件的工艺。目标是将最小组件尺寸远远减小到现有水平，同时支持组装结构之间的电气互连能力。这种方法是基于自组装而不是机器人的拾取和放置。本研究的智力价值在于建立一个知识库，使自组装过程的工程成为可能。这需要对可以使用的力和指导装配过程所必需的环境有全面的了解。更广泛的影响：在任意基板上组装和互连材料和设备的能力允许基于其他不兼容材料的技术合并。应用包括柔性高性能电子产品、太阳能电池和传感器系统，用于收集光学、声学、化学和/或放射数据，这些数据将改善我们日常生活的许多领域，包括医疗保健、环境、能源、食品安全、制造业和国家安全。研究工作和新的知识基础将导致研讨会和课程材料的发展，这将影响研究生和高级本科生，而不是直接参与研究的学生。