Directed Assembly: Integration of Heterogeneous Systems Across Length Scales and Material Boundaries

定向组装：跨长度尺度和材料边界的异构系统集成

• 批准号: 0601454
• 负责人: Heiko Jacobs
• 金额: $ 27万
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-04-15 至 2011-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0601454&HistoricalAwards=false
• 关键词: Directed; Assembly; Integration; Heterogeneous; Systems

ECS-0601454H. Jacobs, Univ. of Minnesot-Twin CitiesSummary. The main goal of this proposal remains to develop a directed assembly process to enable the assembly of heterogeneous systems that contain non-identical parts, while supporting the ability of forming electrical interconnects. The revised objectives are:1) A fluidic agitation concept to suspend the disparate parts.2) A new method to activate receptors to enable programmable self-assembly and transfer of chiplets onto desired locations on a surface.3) Defect reduction by combining geometrical shape recognition with surface tension directed self-assembly. 4) Application of the gained knowledge to fabricate a sensor system that contains disparate units for sensing, processing, and communication.The scope is reduced by focusing on the assembly of systems with more readily available components that are 50 mm. Accordingly, the "key chemistry" and agitation using ultrasonification become obsolete. Both will become essential as we scale-down to smaller chip sizes. Given the opportunity we will apply for additional funding to explore these two important elements in the future. Intellectual Merit. The intellectual merit of this proposal is to advance knowledge in an emerging area that can be referred to as directed assembly, self-assembly-by-design, or programmable self-assembly. The focal points are heterogeneous systems and assemblies that contain components made of different materials with different physical dimensions that cannot be assembled effectively with robotic assembly lines, wafer-to-wafer transfer techniques, or existing self-assembly methods.Broader Impact. The ability to assemble disparate microscopic components (integrated circuits, optical components, sensors, actuators, fluidic devices) in two- or three dimensions would impact the creation of improved and entirely new systems that cannot be achieved with current micromachining and microassembly techniques. Applications include sensor systems to gather optical, IR, UV, acoustic, chemical, and/or radiological data that would improve many areas of our daily lives including healthcare, the environment, energy, food safety, manufacturing, and national security.

ECS-0601454H。雅各布斯，明尼苏达大学双城摘要。该提案的主要目标仍然是开发一种定向组装工艺，以实现包含不相同部件的异构系统的组装，同时支持形成电互连的能力。修改后的目标是：1）流体搅拌的概念，悬浮不同的部分。2）一种新的方法来激活受体，使可编程的自组装和转移的小芯片到表面上的所需位置。3）缺陷减少相结合的几何形状识别与表面张力导向的自组装。4)应用所获得的知识制造传感器系统，该系统包含用于传感、处理和通信的不同单元。通过专注于更容易获得的50 mm组件的系统组装，范围缩小。因此，“关键化学”和使用超声波的搅拌变得过时。随着我们缩小到更小的芯片尺寸，这两者都将变得至关重要。如果有机会，我们将在未来申请额外资金，以探索这两个重要因素。 智力优势。这一建议的智力价值是推进知识在一个新兴的领域，可以被称为定向组装，自组装设计，或可编程自组装。重点是异构系统和组件，这些系统和组件包含由不同材料制成的不同物理尺寸的组件，这些组件无法通过机器人装配线、晶圆到晶圆转移技术或现有的自组装方法进行有效组装。在二维或三维中组装不同的微观组件（集成电路、光学组件、传感器、致动器、流体设备）的能力将影响改进的和全新的系统的创建，这是当前的微加工和微组装技术无法实现的。应用包括传感器系统，用于收集光学、IR、UV、声学、化学和/或放射性数据，这些数据将改善我们日常生活的许多领域，包括医疗保健、环境、能源、食品安全、制造业和国家安全。