Chip-Level Self-Assembly: Tools and components that self-assemble and self-package to form desired microsystems

芯片级自组装：自组装和自封装以形成所需微系统的工具和组件

• 批准号: 0300263
• 负责人: Heiko Jacobs
• 金额: --
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-05-01 至 2007-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0300263&HistoricalAwards=false
• 关键词: Chip; Level; Self; Assembly; Tools

Broader Impact: If the research part of this work proves successful, it could have tremendous impact. The ability to assemble multiple components (integrated circuits, optical components, sensors, actuators, fluidic devices) in two or three dimensions will enable the creation of improved and entirely new microsystems that go far beyond the capacities of current micromachining and microassembly. Furthermore, it would allow the merging of technologies based on otherwise incompatible materials. Examples of known applications include flexible displays, smart materials, integrated circuits on plastics or fabrics for wearable intelligence, and merged optical/electronic structures for optical off-chip and cross-chip communication.Societal Implications: Advances in Microtechnology including Self-assembly Based Manufacturing promise to have major implications for health, wealth, and peace in the upcoming decades. Knowledge in this field is growing worldwide, leading to fundamental scientific advances. In turn, this will lead to dramatic changes in the ways that materials, devices, and systems are understood and created. The proposed research is one element to advance knowledge in this field. It suggests a dramatic change in the way that devices and systems are created.The first objective is to develop a parallel tool that is based on directed self-assembly to assemble, and electrically connect chip-level-sized components, to form two and three-dimensional microsystems. This research includes (i) the study of the key factors affecting the assembly in experiment and theory, (ii) the demonstration of large area assemblies with minimal defects, (iii) the investigation of different schemes of agitation using acceleration and fluid flow, (iv) and the study of the resolution limit of surface tension-driven self-assembly involving liquid solder.The second objective is to apply the gained knowledge to design intelligent components that undergo self- assembly to form a desired device. Proposed examples are (i) self-packaging chips for micro- and optoelectronics, and (ii) hemispherical emitter/detector arrays for surveillance.The third objective of this program is to foster a cross-disciplinary education of our students and outreach to the general public.

更广泛的影响：如果这项工作的研究部分被证明是成功的，它可能会产生巨大的影响。在二维或三维空间组装多个组件(集成电路、光学组件、传感器、致动器、流体设备)的能力将使改进后的全新微系统的创建远远超出当前微机械加工和微组装的能力。此外，它将允许基于其他不兼容材料的技术合并。已知应用的例子包括柔性显示器、智能材料、用于可穿戴智能的塑料或织物上的集成电路，以及用于光学芯片外和跨芯片通信的合并的光学/电子结构。社会影响：包括基于自组装的制造在内的微技术的进步有望在未来几十年对健康、财富和和平产生重大影响。这一领域的知识在全球范围内不断增长，导致了基础科学的进步。反过来，这将导致材料、设备和系统被理解和创造的方式发生戏剧性的变化。这项拟议的研究是促进这一领域知识的一个因素。第一个目标是开发一种基于定向自组装的并行工具来组装芯片大小的元件，并将其电连接起来，形成二维和三维微系统。这项研究包括(1)实验和理论上影响组装的关键因素的研究；(2)大面积最小缺陷组装的演示；(3)利用加速度和流体流动的不同搅拌方案的研究；(4)液体焊料表面张力驱动自组装的分辨率极限的研究。第二个目标是应用所获得的知识来设计经过自组装的智能元件以形成所需的器件。建议的例子是(I)用于微电子和光电子的自封装芯片，以及(Ii)用于监视的半球形发射器/探测器阵列。这项计划的第三个目标是促进对我们的学生进行跨学科的教育，并向公众推广。