SHF: Small: Collaborative Research: Testing and Design-for-Testability Solutions for 3D Stacked Integrated Circuits

SHF：小型：协作研究：3D 堆叠集成电路的测试和可测试性设计解决方案

• 批准号: 1017277
• 负责人: Mary Irwin
• 金额: $ 20万
• 依托单位: Pennsylvania State Univ University Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-09-01 至 2015-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1017277&HistoricalAwards=false
• 关键词: SHF; Small; Collaborative; Research; Testing

Three-dimensional stacked integrated circuits (3D SICs) promise to overcome barriers in interconnect scaling, thereby offering an opportunity to get higher performance using CMOS technology. This collaborative project between Duke University and Pennsylvania State University is focused on test and design-for-testability (DFT) solutions for 3D SICs. Topics being investigated include: (i) fault modeling and test generation, where the goal is to develop new fault models and test generation methods that can effectively target defects unique to 3D SICs; (ii) DFT infrastructure, optimization techniques for test access, and test scheduling methods for pre-bond test and post-bond test; (iii) Test economics and a cost-analysis framework, where test cost is being incorporated into cost models for 3D IC design and fabrication. This project will facilitate further advances in 3D integration and wider adoption of this emerging technology by the semiconductor industry. Innovations in test methods, DFT, and cost modeling will therefore have a transformative impact on the way in which semiconductor chips are designed and fabricated. Undergraduate and graduate students involved in this research will be trained for the next-generation semiconductor industry workforce. Tools and techniques developed in this research will be used in teaching existing courses and developing new courses. A virtual classroom through web delivery will facilitate collaborative lectures originating from Duke and Penn State. The PIs will make tools available through the web for use by other educators, researchers, and industry practitioners. At Duke, the PI will mentor undergraduate students in collaboration with the Associate Dean for Education and Outreach Programs in the Pratt School of Engineering, and generate excitement among high-school students at the North Carolina School of Science and Mathematics.

三维堆叠的集成电路（3D SIC）承诺将克服互连缩放的障碍，从而提供使用CMOS技术获得更高性能的机会。杜克大学与宾夕法尼亚州立大学之间的合作项目专注于3D SICS的测试和设计解决方案（DFT）解决方案。正在研究的主题包括：（i）故障建模和测试生成，目标是开发新的故障模型和测试生成方法，这些方法可以有效地靶向3D SICS独有的缺陷； （ii）DFT基础架构，用于测试访问的优化技术以及用于键盘测试和键后测试的测试调度方法； （iii）测试经济学和成本分析框架，其中将测试成本纳入3D IC设计和制造的成本模型中。该项目将促进半导体行业对这项新兴技术的更广泛采用的进一步进步。因此，测试方法，DFT和成本建模的创新将对设计和制造半导体芯片的方式产生变革性的影响。参与这项研究的本科生和研究生将接受下一代半导体行业劳动力的培训。这项研究中开发的工具和技术将用于教授现有课程和开发新课程。通过网络交付的虚拟教室将有助于源自杜克大学和宾夕法尼亚州立大学的协作讲座。 PI将通过网络提供工具，供其他教育者，研究人员和行业从业人员使用。 在杜克大学，PI将指导本科生与普拉特工程学院的教育和外展副院长合作，并在北卡罗来纳州科学与数学学院的高中生中引起兴奋。