SHF: Small: Standardized On-line Test and Verification Architecture Using TFTs on Glass and Inductive Wireless Links

在过去的几十年里，半导体工业主要是由不断提高的性能和晶体管数量驱动的。系统设计复杂性的增加增加了测试和验证的重要性和复杂性。复杂CMOS系统在线测试的需求和降低离线测试成本，要求系统和标准化的测试和验证方法。未来的测试和验证方法将使用模块化架构、可编程拓扑来解决时变测试需求，以及通过操作软件进行简单访问和重新配置的集中控制方案。提出的测试和验证架构将利用低成本低温多晶硅（LTPS）薄膜晶体管（TFT）电路，将玻璃或塑料衬底堆叠在硅衬底上。在线测试控制模块通过射频无线感应链路将测试矢量传输到玻璃/塑料基板上的多个TFT测试电路。无线链路允许并行（广播）和串联传输。如果需要，电源和定时（时钟）信号可以与测试矢量一起无线传输。TFT测试电路通过倒装芯片碰撞触点对底层硅CMOS电路进行评估和监测，并将收集到的响应数据传回测试控制模块。所提出的体系结构具有以下特点：(1)低成本；(2)模块化；(3)可应用可编程测试向量进行时变在线测试；(4)易于操作软件访问和控制。所提出的测试电路将驻留的tft应该具有合理的性能，并在cmos兼容的电源电压下工作。该研究还将研究和开发优化的TFT结构和无源，用于CMOS兼容操作，并适用于与标准CMOS系统的3D集成。对低成本、低功耗、高性能电子产品的需求正在迅速增长。在柔性基板上优化TFT器件，实现低功耗、兼容CMOS电源电压的合理性能是可能的。传统上，TFTs被用于速度不重要的高压显示应用。因此，本研究是优化和使用tft以实现更高性能和更低功耗的一种新方法，除了低成本测试/验证应用之外，还开辟了大量应用，例如基于TFT-CMOS混合架构的低功耗dsp和传感器。实现更高性能的能力？柔性基板上的TFTs具有低成本工艺，也有助于将此类电子/传感器嵌入诸如衣服，汽车，飞机等材料上。鉴于这些方法的可能性，迫切需要开发此类器件以及相应的模型和仿真工具，以利用这些器件的独特特性来实现高产量，可靠的性能和低功耗。这将从器件、电路和架构的角度增强我们对柔性电子的理解，并为柔性电子技术的发展打开大门。比摩尔还厉害？应用程序。

Over the past few decades, the semiconductor industry has been primarily driven by increasing performance and transistor counts. The increase in system design complexity increases the importance and complexity of test and verification. The need for on-line testing of complex CMOS systems and to reduce the off-line test cost, mandate a systematic and standardized test and verification methodology. The future test and verification methodology will use a modular architecture, a programmable topology to address time varying test requirements, and a centralized control scheme for simple access and reconfiguration by operating software. The proposed test and verification architecture will utilize low-cost low temperature poly-Si (LTPS) thin film transistor (TFT) circuits on glass or plastic substrate stacked on top of a silicon substrate. An on-line test control module transmits test vectors to multiple TFT test circuits on glass/plastic substrate through RF wireless inductive links. The wireless link allows both parallel (broadcasting) and series transmissions. Power and timing (clock) signals can be wirelessly transmitted along with the test vectors, if required. The TFT test circuits evaluate and monitor the underlying silicon CMOS circuits through flip-chip bump contacts and transmit the collected response data back to the test control module. The proposed architecture is: (1) low-cost, (2) modular, (3) can apply programmable test vectors for time varying on-line tests, and (4) allows easy access and control by operating software. The TFTs on which the proposed test circuits would reside, should have reasonable performance and work with CMOS-compatible supply voltages. The proposed research will also investigate and develop optimized TFT structures and passives for CMOS-compatible operations and suitable for 3D integration with standard CMOS systems.The need for low-cost low-power high-performance electronics is rapidly growing. It is possible to optimize TFT devices on flexible substrates to achieve reasonable performance with low-power dissipation, with CMOS compatible supply voltage. Traditionally, TFTs have been used in high voltage display applications where speed is not important. This research is therefore, a novel way of optimizing and using TFTs for higher performance and lower-power, opening up a plethora of applications such as low-power DSPs and sensors based on the TFT-CMOS hybrid architecture in addition to the low-cost test/verification application. The ability to implement ?higher-performance? TFTs on flexible substrate with a low-cost process also helps in embedding such electronics/sensors on materials such as clothes, automobiles, planes, etc. Given the possibilities with such approaches, there is a pressing need to develop such devices and corresponding models and simulation tools to harness the unique characteristics of these devices to achieve high-yield, reliable performance and low-power dissipation. This will enhance our understanding of flexible electronics from device, circuit, and architecture perspectives and open the door for ?more than Moore? applications.