SHF: Medium: Closing Multiphysics Analysis Gaps in System Design

SHF：中：缩小系统设计中的多物理场分析差距

• 批准号: 1564302
• 负责人: Andrew Kahng
• 金额: $ 90万
• 依托单位: University of California-San Diego
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2016
• 资助国家: 美国
• 起止时间: 2016-07-15 至 2022-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1564302&HistoricalAwards=false
• 关键词: SHF; Medium; Closing; Multiphysics; Analysis

Design tools and methods for electronic components need to ensure that they are low-cost, low-energy, last longer, deliver better performance, and operate correctly across a diverse range of conditions. To guarantee this, engineers need analysis tools that understand mechanical shock, temperature, aging and in addition to electrical phenomena - in short, many different "physics" that are all wrapped up into a single analysis question. The analysis must also span time scales from nanoseconds to years, and spatial scales from nanometers to centimeters. Such tools do not exist today. This project will develop the "multiphysics" analysis methods that aims to address such questions for future electronic system designers. Researchers will bring together techniques from chip design, thermal and reliability analysis, mechanical simulation and other domains learning each other?s fields of expertise, and creating new analysis tools that will be used in both industry and teaching contexts. The outreach aspects of the project involve training undergraduate and graduate students for the electronic design automation industry.The project will have three main technical goals. The first goal is to come up with fast algorithms to simulate and predict the physics of heat propagation, mechanical stress, and electrical signaling in extremely complex structures. The second goal is to enable computer codes to span multiple scales in space and in time. This will allow system design tools to correctly analyze propagation of electrical signals through nanoscale devices as the larger system is subjected to heating or mechanical shocks occurring at much longer time scales. The third goal is to develop new ways of efficiently understanding "multiphysics", e.g., the interaction between electrical, thermal and mechanical, along with temporal phenomena, when analyzing an electronic system.

电子元件的设计工具和方法需要确保它们低成本、低能耗、寿命更长、提供更好的性能，并在各种条件下正确运行。为了保证这一点，工程师们需要能够理解机械冲击、温度、老化以及电学现象的分析工具--简而言之，许多不同的“物理学”都被包装成一个单一的分析问题。分析还必须跨越从纳秒到数年的时间尺度，以及从纳米到厘米的空间尺度。这样的工具在今天是不存在的。该项目将开发“多物理”分析方法，旨在为未来的电子系统设计者解决这些问题。研究人员将把芯片设计、热和可靠性分析、机械仿真等领域的技术结合起来，相互学习S的专业知识领域，并创造出将在工业和教学环境中使用的新分析工具。该项目的外展方面涉及为电子设计自动化行业培训本科生和研究生。该项目将有三个主要的技术目标。第一个目标是提出快速算法来模拟和预测极其复杂结构中的热传播、机械应力和电信号的物理过程。第二个目标是使计算机代码能够在空间和时间上跨越多个尺度。这将使系统设计工具能够正确地分析电信号通过纳米设备的传播，因为较大的系统在更长的时间尺度上受到加热或机械冲击。第三个目标是开发有效理解“多物理”的新方法，例如，在分析电子系统时，电、热和机械之间的相互作用以及时间现象。