GOALI: Mm-Wave Reconfigurable Additive Manufactured Packaging Systems (RAMPS) using Pulsed Picosecond Laser Processing

GOALI:使用脉冲皮秒激光加工的毫米波可重构增材制造包装系统 (RAMPS)

基本信息

  • 批准号:
    1912679
  • 负责人:
  • 金额:
    $ 30.85万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2018
  • 资助国家:
    美国
  • 起止时间:
    2018-08-31 至 2021-08-31
  • 项目状态:
    已结题

项目摘要

The aim of this project is to investigate packaging technologies for high frequency microelectronic circuits that will provide critical performance enhancements for next generation wireless systems. The approach is based on the use of low cost additive manufacturing or 3D printing processes, and will require advances in areas such as minimum feature size, reconfigurable electronic and mechanical structures, and millimeter-wave frequency circuit design. The proposed approach of integrating the functionality needed to dynamically reconfigure a mm-wave system directly into the 3D-printed packaging is a new concept, since current packaging technologies predominantly serve only to provide environmental protection with no electronic purpose. The new structural electronic packaging concept could therefore significantly disrupt the microelectronics packaging industry, as the functional packaging would provide the ability to perform actions such as changing operating frequencies and steering antenna beams in real-time. The technology could impact important emerging applications such as 5G wireless, the internet of things and autonomous and connected vehicles. It could also expand into fields such as wearable electronics, bio-electronic devices, and artificial organs. In addition to training graduate students the project will impact K-12 education by offering training opportunities to high school teachers and students. Undergraduate students will also be involved through Research Experience for Undergraduates projects and multi-disciplinary Senior Capstone Design projects that are outlined by the industry partner. The principal investigators will continue to emphasize the participation of students from diverse backgrounds and underrepresented groups in engineering, and include a focus on the attainment of global perspectives and leadership skills as part of their training.The technical goal of the project is to advance the state of the art in millimeter wave packaging technology by demonstrating new approaches for direct integration of low temperature on-package and on-chip structural electronics. The aim is to study concepts for reconfigurable packaging using dynamic structures that are fabricated using additive manufacturing. Specifically, the research will involve a hybrid, direct print additive manufacturing strategy that combines fused filament fabrication and micro-dispensing to form the package foundation in a conformal manner directly onto the microelectronic device or component. The critical electronic and mechanical features will be defined using pulsed picosecond laser machining with a targeted minimum feature size of 3-5 microns. Performance goals include variable reactance devices with greater than 5:1 tuning in the upper Ka-band and interconnects with less than 0.7 dB/cm loss in the V-band. The proposed work has potential to make significant contributions in the area of functional electronic packaging, which may prove to be one of the most economically and technically important applications of direct print additive manufacturing. To date, no additive manufactured tunable devices have been demonstrated at millimeter wave frequencies. Furthermore, there are no existing packaging technologies that can combine the advantages of low temperature processing, conformal integration and dynamic real-time reconfigurability. Finally, since the proposed approach is generic in nature it will be broadly applicable to a wide range of microwave/mm-wave communications and sensing systems. The project's industry partner brings expertise in microwave packaging and manufacturing and will play a critical role in steering the investigations to maximize future commercial impact.
该项目的目的是研究高频微电子电路的封装技术,为下一代无线系统提供关键的性能增强。该方法基于低成本增材制造或3D打印工艺的使用,并需要在最小特征尺寸,可重新配置的电子和机械结构以及毫米波频率电路设计等领域取得进展。 将动态重新配置毫米波系统所需的功能直接集成到3D打印包装中的方法是一个新概念,因为目前的包装技术主要只用于提供环境保护,而没有电子用途。 因此,新的结构化电子封装概念可能会显著颠覆微电子封装行业,因为功能性封装将提供执行诸如实时改变工作频率和操纵天线波束等操作的能力。 该技术可能会影响重要的新兴应用,如5G无线、物联网以及自动驾驶和联网车辆。 它还可以扩展到可穿戴电子产品、生物电子设备和人工器官等领域。除了培训研究生外,该项目还将通过为高中教师和学生提供培训机会来影响K-12教育。 本科生也将参与研究经验的本科生项目和多学科的高级顶点设计项目,由行业合作伙伴概述。主要研究人员将继续强调来自不同背景和代表性不足的群体的学生参与工程,该项目的技术目标是通过展示直接集成低温封装和低温封装的新方法,推动毫米波封装技术的发展。芯片结构电子学其目的是研究使用增材制造的动态结构进行可重构包装的概念。具体而言,该研究将涉及一种混合、直接打印增材制造策略,该策略将熔丝制造和微点胶相结合,以保形方式直接在微电子器件或组件上形成封装基础。关键的电子和机械特征将使用脉冲皮秒激光加工来定义,目标最小特征尺寸为3-5微米。 性能目标包括可变电抗器件,在上Ka波段调谐大于5:1,在V波段互连损耗小于0.7 dB/cm。 拟议的工作有可能在功能性电子封装领域做出重大贡献,这可能是直接打印增材制造在经济和技术上最重要的应用之一。到目前为止,还没有增材制造的可调谐器件在毫米波频率下得到证实。此外,不存在可以将低温处理、保形集成和动态实时可重构性的优点联合收割机组合的现有封装技术。 最后,由于所提出的方法是通用的性质,它将广泛适用于广泛的微波/毫米波通信和传感系统。该项目的行业合作伙伴带来了微波包装和制造方面的专业知识,并将在指导调查以最大限度地提高未来商业影响方面发挥关键作用。

项目成果

期刊论文数量(9)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Laser Assisted Additive Manufacturing of CPW mm-Wave Interdigital Capacitors
CPW 毫米波叉指电容器的激光辅助增材制造
Direct digital manufacturing of mm-wave vertical interconnects
毫米波垂直互连的直接数字化制造
Thermal and Vapor Smoothing of Thermoplastic for Reduced Surface Roughness of Additive Manufactured RF Electronics
热塑性塑料的热和蒸汽平滑可降低增材制造射频电子器件的表面粗糙度
  • DOI:
    10.1109/tcpmt.2019.2910791
  • 发表时间:
    2019
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Neff, Clayton;Rojas-Nastrucci, Eduardo A.;Nussbaum, Justin;Griffin, Darrell;Weller, Thomas M.;Crane, Nathan B.
  • 通讯作者:
    Crane, Nathan B.
Laser enhanced direct print additive manufacturing for mm-wave components and packaging
用于毫米波元件和包装的激光增强直接打印增材制造
Analytical and Experimental Study of Multilayer Dielectric Rod Waveguides
多层介质棒波导的分析与实验研究
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Thomas Weller其他文献

Structure–activity relationship studies and sleep-promoting activity of novel 1-chloro-5,6,7,8-tetrahydroimidazo[1,5-<em>a</em>]pyrazine derivatives as dual orexin receptor antagonists. Part 2
  • DOI:
    10.1016/j.bmcl.2013.04.071
  • 发表时间:
    2013-07-01
  • 期刊:
  • 影响因子:
  • 作者:
    Thierry Sifferlen;Ralf Koberstein;Emmanuelle Cottreel;Amandine Boller;Thomas Weller;John Gatfield;Catherine Brisbare-Roch;Francois Jenck;Christoph Boss
  • 通讯作者:
    Christoph Boss
Theatrum Praecedentiae : zeremonieller Rang und gesellschaftliche Ordnung in der frühneuzeitlichen Stadt : Leipzig 1500-1800
实践剧场:早期城市的泽蒙尼尔·兰格和社会秩序:莱比锡 1500-1800 年
  • DOI:
  • 发表时间:
    2006
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Thomas Weller
  • 通讯作者:
    Thomas Weller
Herstellung von 1, 3-Diketonen und von Nitro-diketonen durch (1:1)-Acylierungen von Lithiumenolaten mit Acylchloriden
1, 3-二酮和硝基二酮 (1:1)-酰氯锂的酰化
  • DOI:
    10.1002/hlca.19810640313
  • 发表时间:
    1981
  • 期刊:
  • 影响因子:
    1.8
  • 作者:
    D. Seebach;Thomas Weller;Gerd Protschuk;Albert K. Beck;Marvin S. Hoekstra
  • 通讯作者:
    Marvin S. Hoekstra
Orally active fibrinogen receptor antagonists. 2. Amidoximes as prodrugs of amidines.
口服活性纤维蛋白原受体拮抗剂。
  • DOI:
  • 发表时间:
    1996
  • 期刊:
  • 影响因子:
    7.3
  • 作者:
    Thomas Weller;L. Alig;Maureen Beresini;Brent Blackburn;Stuart Bunting;P. Hadváry;Marianne Hürzeler Müller;Dietmar Knopp;Bernard Levet;M. Terry Lipari;Nishit B. Modi;Marcel Müller;C. Refino;Monique Schmitt;Peter Schönholzer;Sabine Weiss;Beat Steiner
  • 通讯作者:
    Beat Steiner

Thomas Weller的其他文献

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{{ truncateString('Thomas Weller', 18)}}的其他基金

Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)
合作研究:FuSe:低损耗电磁和射频系统异构集成的热协同设计(CHILLERS)
  • 批准号:
    2329206
  • 财政年份:
    2023
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Continuing Grant
Travel: 2023 International Microwave Symposium Educational Initiatives for Project Connect
旅行:2023 年国际微波研讨会 Project Connect 教育举措
  • 批准号:
    2312225
  • 财政年份:
    2023
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI: Collaborative Research: Integrated Antenna System Design for High Clutter and High Bandwidth Channels Using Advanced Propagation Models
GOALI:协作研究:使用先进传播模型的高杂波和高带宽信道集成天线系统设计
  • 批准号:
    1853174
  • 财政年份:
    2018
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI: Mm-Wave Reconfigurable Additive Manufactured Packaging Systems (RAMPS) using Pulsed Picosecond Laser Processing
GOALI:使用脉冲皮秒激光加工的毫米波可重构增材制造包装系统 (RAMPS)
  • 批准号:
    1711790
  • 财政年份:
    2017
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI: Collaborative Research: Integrated Antenna System Design for High Clutter and High Bandwidth Channels Using Advanced Propagation Models
GOALI:协作研究:使用先进传播模型的高杂波和高带宽信道集成天线系统设计
  • 批准号:
    1509762
  • 财政年份:
    2015
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
2014 IEEE International Microwave Symposium Project Connect Support. To Be Held in Tampa, FL June 1-6, 2014.
2014 年 IEEE 国际微波研讨会项目 Connect 支持。
  • 批准号:
    1362027
  • 财政年份:
    2014
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI Collaborative Proposal: 3D RF Microsystems using Direct Digital Manufacturing Technology
GOALI 协作提案:使用直接数字制造技术的 3D RF 微系统
  • 批准号:
    1232183
  • 财政年份:
    2012
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI/COLLABORATIVE RESEARCH - Flexible Ferroelectric-Based Antenna Arrays For Conformal Radiometric Imaging
GOALI/协作研究 - 用于共形辐射成像的柔性铁电天线阵列
  • 批准号:
    0901779
  • 财政年份:
    2009
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
Collaborative Project: Multi-University Systems Education (MUSE) - A Model for Undergraduate Learning of Complex-Engineered Systems
合作项目:多大学系统教育 (MUSE) - 复杂工程系统本科学习模型
  • 批准号:
    0716317
  • 财政年份:
    2007
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant
GOALI: Functional Magnetic Polymer Nanocomposite Films for Tunable RD Device Applications
GOALI:用于可调谐 RD 设备应用的功能磁性聚合物纳米复合薄膜
  • 批准号:
    0728073
  • 财政年份:
    2007
  • 资助金额:
    $ 30.85万
  • 项目类别:
    Standard Grant

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All Analogue Full-duplex Dual-receiver Radio for Wideband Mm-wave Communications
用于宽带毫米波通信的全模拟全双工双接收器无线电
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PFI-TT: Enhancing Manufacturing with Real-Time Defect Detection using mm-Wave Antenna Sensors
PFI-TT:使用毫米波天线传感器通过实时缺陷检测增强制造
  • 批准号:
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ECCS-EPSRC - Advanced III-N Devices and Circuit Architectures for mm-Wave Future-Generation Wireless Communications
ECCS-EPSRC - 用于毫米波下一代无线通信的先进 III-N 器件和电路架构
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