GOALI: Mm-Wave Reconfigurable Additive Manufactured Packaging Systems (RAMPS) using Pulsed Picosecond Laser Processing

GOALI：使用脉冲皮秒激光加工的毫米波可重构增材制造包装系统 (RAMPS)

• 批准号: 1912679
• 负责人: Thomas Weller
• 金额: $ 30.85万
• 依托单位: Oregon State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2018
• 资助国家: 美国
• 起止时间: 2018-08-31 至 2021-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1912679&HistoricalAwards=false
• 关键词: GOALI; Mm; Wave; Reconfigurable; Additive

The aim of this project is to investigate packaging technologies for high frequency microelectronic circuits that will provide critical performance enhancements for next generation wireless systems. The approach is based on the use of low cost additive manufacturing or 3D printing processes, and will require advances in areas such as minimum feature size, reconfigurable electronic and mechanical structures, and millimeter-wave frequency circuit design. The proposed approach of integrating the functionality needed to dynamically reconfigure a mm-wave system directly into the 3D-printed packaging is a new concept, since current packaging technologies predominantly serve only to provide environmental protection with no electronic purpose. The new structural electronic packaging concept could therefore significantly disrupt the microelectronics packaging industry, as the functional packaging would provide the ability to perform actions such as changing operating frequencies and steering antenna beams in real-time. The technology could impact important emerging applications such as 5G wireless, the internet of things and autonomous and connected vehicles. It could also expand into fields such as wearable electronics, bio-electronic devices, and artificial organs. In addition to training graduate students the project will impact K-12 education by offering training opportunities to high school teachers and students. Undergraduate students will also be involved through Research Experience for Undergraduates projects and multi-disciplinary Senior Capstone Design projects that are outlined by the industry partner. The principal investigators will continue to emphasize the participation of students from diverse backgrounds and underrepresented groups in engineering, and include a focus on the attainment of global perspectives and leadership skills as part of their training.The technical goal of the project is to advance the state of the art in millimeter wave packaging technology by demonstrating new approaches for direct integration of low temperature on-package and on-chip structural electronics. The aim is to study concepts for reconfigurable packaging using dynamic structures that are fabricated using additive manufacturing. Specifically, the research will involve a hybrid, direct print additive manufacturing strategy that combines fused filament fabrication and micro-dispensing to form the package foundation in a conformal manner directly onto the microelectronic device or component. The critical electronic and mechanical features will be defined using pulsed picosecond laser machining with a targeted minimum feature size of 3-5 microns. Performance goals include variable reactance devices with greater than 5:1 tuning in the upper Ka-band and interconnects with less than 0.7 dB/cm loss in the V-band. The proposed work has potential to make significant contributions in the area of functional electronic packaging, which may prove to be one of the most economically and technically important applications of direct print additive manufacturing. To date, no additive manufactured tunable devices have been demonstrated at millimeter wave frequencies. Furthermore, there are no existing packaging technologies that can combine the advantages of low temperature processing, conformal integration and dynamic real-time reconfigurability. Finally, since the proposed approach is generic in nature it will be broadly applicable to a wide range of microwave/mm-wave communications and sensing systems. The project's industry partner brings expertise in microwave packaging and manufacturing and will play a critical role in steering the investigations to maximize future commercial impact.

该项目的目的是研究高频微电子电路的封装技术，这将为下一代无线系统提供关键的性能增强。该方法基于使用低成本的增材制造或3D打印工艺，并且需要在诸如最小特征尺寸，可重构电子和机械结构以及毫米波频率电路设计等领域取得进展。将动态重新配置毫米波系统所需的功能直接集成到3d打印包装中的方法是一个新概念，因为目前的包装技术主要只提供环境保护，没有电子目的。因此，新的结构电子封装概念可能会显著扰乱微电子封装行业，因为功能封装将提供执行诸如实时改变操作频率和操纵天线波束等操作的能力。这项技术可能会影响5G无线、物联网、自动驾驶和联网汽车等重要的新兴应用。它还可以扩展到可穿戴电子产品、生物电子设备、人造器官等领域。除了培训研究生外，该项目还将通过为高中教师和学生提供培训机会来影响K-12教育。本科生也将参与由行业合作伙伴概述的本科生研究经验项目和多学科高级顶点设计项目。主要研究人员将继续强调来自不同背景和代表性不足群体的学生参与工程，并将重点放在获得全球视野和领导技能上，作为他们培训的一部分。该项目的技术目标是通过展示直接集成低温封装和片上结构电子器件的新方法，推进毫米波封装技术的最新发展。目的是研究使用增材制造制造的动态结构进行可重构包装的概念。具体来说，该研究将涉及一种混合直接打印增材制造策略，该策略结合了熔丝制造和微点胶，以保形方式直接在微电子器件或组件上形成封装基础。关键的电子和机械特征将使用脉冲皮秒激光加工来定义，目标最小特征尺寸为3-5微米。性能目标包括可变电抗器件在上ka波段的调谐大于5:1，在v波段的互连损耗小于0.7 dB/cm。提出的工作有可能在功能电子封装领域做出重大贡献，这可能被证明是直接印刷增材制造最经济和技术上重要的应用之一。到目前为止，还没有添加剂制造的可调谐器件在毫米波频率上被证明。此外，目前还没有一种封装技术能够将低温加工、保形集成和动态实时可重构性的优势结合起来。最后，由于所提出的方法本质上是通用的，它将广泛适用于各种微波/毫米波通信和传感系统。该项目的行业合作伙伴带来了微波包装和制造方面的专业知识，并将在指导调查方面发挥关键作用，以最大限度地提高未来的商业影响。

项目成果

Laser Assisted Additive Manufacturing of CPW mm-Wave Interdigital Capacitors

CPW 毫米波叉指电容器的激光辅助增材制造

• DOI: 10.1109/mwsym.2018.8439664
• 发表时间: 2018
• 期刊: 2018 IEEE/MTT-S International Microwave Symposium - IMS
• 作者: Ramirez, Ramiro A.;Lan, Di;Rojas-Nastrucci, Eduardo A.;Weller, Thomas M.
• 通讯作者: Weller, Thomas M.

Direct digital manufacturing of mm-wave vertical interconnects

毫米波垂直互连的直接数字化制造

• DOI: 10.1109/wamicon.2018.8363917
• 发表时间: 2018
• 期刊: 2018 IEEE 19th Wireless and Microwave Technology Conference (WAMICON
• 作者: Rojas-Nastrucci, Eduardo A.;Ramirez, Ramiro A.;Weller, Thomas M.
• 通讯作者: Weller, Thomas M.

Thermal and Vapor Smoothing of Thermoplastic for Reduced Surface Roughness of Additive Manufactured RF Electronics

热塑性塑料的热和蒸汽平滑可降低增材制造射频电子器件的表面粗糙度

• DOI: 10.1109/tcpmt.2019.2910791
• 发表时间: 2019
• 期刊: Packaging and Manufacturing Technology
• 作者: Neff, Clayton;Rojas-Nastrucci, Eduardo A.;Nussbaum, Justin;Griffin, Darrell;Weller, Thomas M.;Crane, Nathan B.
• 通讯作者: Crane, Nathan B.

Laser enhanced direct print additive manufacturing for mm-wave components and packaging

用于毫米波元件和包装的激光增强直接打印增材制造

• DOI: 10.1109/iceaa.2017.8065575
• 发表时间: 2017
• 期刊: 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA
• 作者: Rojas-Nastrucci, Eduardo A.;Ramirez, Ramiro;Hawatmeh, Derar;Lan, Di;Wang, Jing;Weller, Thomas
• 通讯作者: Weller, Thomas

Analytical and Experimental Study of Multilayer Dielectric Rod Waveguides

多层介质棒波导的分析与实验研究

• DOI: 10.1109/tmtt.2021.3056433
• 发表时间: 2021
• 期刊: IEEE Transactions on Microwave Theory and Techniques
• 影响因子: 4.3
• 作者: Lugo, Denise C.;Wang, Jing;Weller, Thomas M.
• 通讯作者: Weller, Thomas M.