US-Japan Joint Workshop on Thermal Transport, Materials Informatics and Quantum Computing

美日热传输、材料信息学和量子计算联合研讨会

• 批准号: 2124850
• 负责人: Tengfei Luo
• 金额: $ 1.99万
• 依托单位: University of Notre Dame
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-04-01 至 2022-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2124850&HistoricalAwards=false
• 关键词: US; Japan; Joint; Workshop; Thermal

This award is to support the US-Japan Joint Workshop on Thermal Transport, Materials Informatics and Quantum Computing to be held virtually on March 22-25, 2021 over the ZOOM and Gather.Town platforms. With the recent advances in artificial intelligence (AI), there is an opportunity to leverage AI to further advance thermal transport so as to maximize the ability to systematically develop thermal materials with desirable properties, i.e., materials-by-design. This workshop seeks to promote conversations among the thermal transport communities and the greater machine learning and materials informatics communities to cultivate international collaborations with Japanese researchers. Quantum computing, as one of important topics in materials informatics, is also a key element of this workshop. The workshop is designed to maximize diversity and inclusion via broadening participations of researchers and engineers from diverse backgrounds and inviting speakers from underrepresented groups. This US-Japan joint workshop brings together researchers from academia, national lab, and industry in both US and Japan to cultivate research collaborations in AI, Materials Informatics, Thermal Transport, and Quantum Computing. It features four themes: Data Infrastructure, AI-driven Experimental Discovery, Simulation-aided Materials Informatics & Thermal Transport, and AI and Quantum Computing. The new opportunities and future research directions identified from this workshop will be disseminated through a perspective article. The AI- and quantum-fueled advances in thermal transport research will also benefit innovations in industry. The workshop will initiate exchanges of students, postdoctoral fellows and faculty, as well as sharing of research facilities between the U.S. and Japan. This workshop will also provide the next generation of scientists and engineers a platform to interact with established researchers and their peers from diverse backgrounds.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该奖项旨在支持将于2021年3月22日至25日在ZOOM和Gather.Town平台上虚拟举行的美日热传输，材料信息学和量子计算联合研讨会。随着人工智能（AI）的最新进展，有机会利用AI进一步推进热传输，以便最大限度地提高系统开发具有理想性能的热材料的能力，即，设计材料。该研讨会旨在促进热传输社区和更大的机器学习和材料信息学社区之间的对话，以培养与日本研究人员的国际合作。量子计算作为材料信息学的重要课题之一，也是本次研讨会的关键内容。该研讨会旨在通过扩大来自不同背景的研究人员和工程师的参与，并邀请代表性不足的群体发言，最大限度地提高多样性和包容性。本次美日联合研讨会汇集了来自美国和日本的学术界、国家实验室和工业界的研究人员，旨在培养人工智能、材料信息学、热传输和量子计算方面的研究合作。研讨会包括四个主题：数据基础设施、人工智能驱动的实验发现、模拟辅助的材料信息学热传输以及人工智能和量子计算。本次研讨会确定的新机会和未来研究方向将通过一篇观点文章传播。人工智能和量子推动的热传输研究进展也将有利于工业创新。该研讨会将启动学生，博士后研究员和教师的交流，以及美国和日本之间的研究设施共享。该研讨会还将为下一代科学家和工程师提供一个平台，与知名研究人员和来自不同背景的同行进行互动。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。