Implantable module-based microchip networks
Implantable module-based microchip networks
批准号:
401023906
负责人:
Professor Dr.-Ing. Maurits Ortmanns
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2018
资助国家:
德国
项目状态:
已结题
起止时间:
2017-12-31 至 2022-12-31
中文摘要
NeuroBus项目涉及实现微型微芯片(µasic)作为神经元接口的植入式网络。具有不同功能的各种Gamma asic被设计为自给自足的模块,可以自由地以可变组合方式组合。各个模块密封封装和聚酰亚胺组装,形成特定的应用网络。该项目的目的是研究材料科学和电子基础知识,以提高新型植入物的生物稳定性和生物相容性。asic的显著小型化,应用密封封装的体积减小以及嵌入高度柔性的聚合物基板使我们期望具有更高的生物耐受性。为了保持无与伦比的长期稳定性,研究的另一个关键方面是没有直流电压,不同组件之间的适应性粘附促进剂以及用薄金属薄膜直接封装asic。所进行的研究工作将找到创建模块化和可扩展的植入物的方法,这些植入物可以个性化,并形成大量其他模块的基础,从而在生物医学应用中得到应用。
英文摘要
The project NeuroBus deals with the realization of an implantable network of miniaturized microchips (µASICs) as neuronal interface. Various Gamma ASICs with different functions are designed as self-sufficient modules that can be freely combined in variable combinations. The individual modules are hermetically encapsulated and assembled on polyimide to form application-specific networks. The aim of the project is to study the material science and electronic fundamentals to achieve increased biostability and biocompatibility of the novel implant concept. A significant miniaturization of the ASICs, the volume reduction of the applied hermetic encapsulation and the embedding in a highly flexible polymer substrate lead us to expect a higher biological tolerability. The absence of DC voltage, the adapted adhesion promoters between the different components and the direct encapsulation of the ASICs with a thin metal film are further key aspects of the study in order to maintain an unequalled long-term stability. The conducted research work will find methods to create modular and scalable implants that can be personalized and which form the basis for a large number of other modules and thus applications in biomedical applications.
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