A high sensitive evalution method for Si surface crystallografic properties by employing surface photovoltage effects.

利用表面光电效应，提出了一种超精密加工表面结晶性能无损评价技术。在本研究中，利用Ar+激光束作为探测光源的单色光电压测量系统是笔者在此基础上发展起来的一种先进的光谱测量系统。在新系统中，构建了一种高灵敏度的表面电压检测方法，使所开发的系统有足够的性能来评估经过弹性发射加工、化学蚀刻或机械化学抛光等超精密加工的硅片表面的性能。

A non-destructive evaluation technique for crystallographic properties of surfaces finished by ultra-precision machining processes has been developed by utilizing surface photo-voltage effects. In this study, spectroscopic measuring system is developed as an advanced type from monochromatic photo-voltage measuring system utilizing Ar+ laser beam as a probe light source which was developed before also by authors. In new system, a detection method of surface voltage with high sensitivity has been constructed so that developed system has enough performance to evaluate the properties of Si wafer surfaces finished by ultra-precision machining processes such as EEM (Elastic Emission Machining), chemical etching or mechanical-chemical polishing.