Development of Diamond Chemical Vapor Deposition Apparatus at High Growth Rate

为了高速合成化学气相沉积（CVD）金刚石，研制了一种具有一个阴极和三个阳极的金刚石CVD装置。扩大了金刚石的沉积面积，并对合成金刚石的力学性能和结晶性能进行了评价。利用所研制的装置产生了由甲烷、氢气和氩气组成的等离子体射流，通过研究电极排列、生长速率、沉积面积和晶线性能之间的关系，讨论了大面积、高生长速率沉积的最佳沉积条件。在CVD金刚石的力学性能方面，对采用YAG激光切割和刨削加工的CVD金刚石刀具在切割A1-12%Si合金时的耐磨性进行了评价。结果表明，随着切削距离的增加，在晶粒间隙处出现了切屑，但切边没有发生切屑，具有良好的耐磨性。此外，CVD金刚石刀具虽然不能获得成形刃，但由于对铝合金的切削，使用金属垫片抛光的CVD金刚石刀具表现出比单晶金刚石刀具更好的耐磨性和更稳定的加工。此外，通过对ZrO_2和Si_3N_4的研磨，评价了金刚石膜作为研磨工具制备的CVD金刚石粉的力学性能。

In order to synthesize diamond by chemical vapor deposition (CVD) at high growth rate, an diamond CVD apparatus which has a cathode and three anodes has been developed. Diamond deposition area has been enlarged, and mechanical and crystalline properties of diamond synthesized has been evaluated.A plasma jet consists of methane, hydrogen and argon gases were generated by the apparatus developed, and the optimum deposition conditions for large area and high growth rate deposition were discussed by investigating of the relation among an arrangement of electrodes, a growth rate, a deposition area and crystal-line property.On the mechanical property of CVD diamond, the wear resistance of CVD diamond cutting tool fabricated by YAG laser cutting and planing was evaluated in cutting A1-12%Si alloy. It is found that the chipping of cutting edge is not occur and good wear resistance is proved though the chipping is occurs at gaps among grains with increasing cutting distance. Moreover, the CVD diamond cutting tool polished using a scaife has shown a better wear resistance and a stabler processing than a single crystal diamond cutting tool as a result of cutting of aluminum alloy, though CVD diamond cutting tool cannot obtain a shaper edge.Moreover, the mechanical performance of CVD diamond powder produced from roll milling diamond films as the grinding tool was evaluated by grinding of ZrO_2 and Si_3N_4.