DEVELOPMENT OF LASER PROCESSING SYSTEM WITH TWO COLOR PYROMETER

本研究的目的是建立一个高精度的微细加工激光加工系统。利用一种新型的光纤红外辐射高温计，对激光辐照下工件的温度进行了精确测量。本研究取得的主要成果如下：1.建立了激光辐照下工件温度测量的基本技术.建立了一种控制硅片断裂过程中裂纹发展方向的技术。通过测量声发射信号，可以监测硅片上裂纹的发展过程.确定了不锈钢板成形过程中工件辐照温度与变形角的关系。因此，我们可以通过监测温度来控制变形.微金刚石砂轮和液晶玻璃的破碎，以及半导体电池引线框架的成型，是今后研究的课题。

The objective of the present study is to establish a laser machining system for micro machining in a high precision. The temperature of workpiece irradiated with laser is measured accurately using a new type of infrared radiation pyrometer with an optical fiber. The main results obtained in this study are summarized as follows :1. A basic technique for measuring temperature of workpiece irradiated with laser is established.2. A technique for controlling crack progress direction in breaking of silicon wafer is established. And by measuring AE signal, we can monitor the crack progress on the wafer.3. The relationship between the temperature of workpiece irradiated with the deformation angle in forming of stainless plate is determined. Consequently, we can control the deformation by monitoring the temperature.4. Breaking of micro-diamond grindstone and liquid-crystal glass, and forming of lead frame of semiconductor cell, are become the subjects for future study.