Studies on Reactive Sputtering Processes of Oxide Thin Films
氧化物薄膜反应溅射工艺研究
基本信息
- 批准号:11680488
- 负责人:
- 金额:$ 1.02万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (C)
- 财政年份:1999
- 资助国家:日本
- 起止时间:1999 至 2001
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
In the fiscal year 2001, we have succeeded in producing the high density ICP, and investigated the fundamental discharge properties under several operation conditions such as the sole PM operation, the sole ICP operation, and the simultaneous operation of PM and ICP.The use of functional oxide thin films such as MgO, TiO_2, ZnO, and A1_2O_3 has been rapidly increasing in industry because of superior electrical, optical, mechanical, and biological nature of these materials. Thus, the high-rate deposition of high-quality oxide thin films has been more demanded than ever. In the past, various techniques such as sputtering, electron-beam evaporation, ion plating, and sol-gel methods, have been used for the fabrication of oxide thin films. In general, the sputtering method has the distinct advantages of low temperature processing for polycrystalline materials, film uniformity over large areas, and scalabiliry; however, its industrial application has been limited due to its low deposition ra … More te. For example, the deposition rate for MgO in the sputter based method is at the most 0.5 nm/s. For the purpose of high-rate deposition of high-quality magnesium oxide thin films that have been used as the protection-layers of discharge electrodes in plasma display panels, we have proposed a new reactive sputtering process in which conventional planar magnetron (PM) is assisted -by the inductively coupled plasma (ICP).Obtained results in the fiscal year 2001 are summarized as follows :1) By-using an internal single-turn coil antenna, we have succeeded in producing high-density ICP.2) Application of 13.56MHz RF power of several hundreds ofW generated an ideal ICP with a density of more than 10^<17>m^<-3>.3) As a result of the optical emission measurements of the axial and radial spatial profiles with an image-intensified CCD camera and spectrometers, we have confirmed that an ideal ICP was produced between the target and substrate electrodes.4) As a result of the comparison between the above-mentioned operation conditions, we have confirmed that the simultaneous operation of ICP and PM is effective for reionizing the sputtered metallic atoms. Less
在2001年度,我们成功地制造了高密度ICP,并研究了在单独PM操作、单独ICP操作以及PM和ICP同时操作等几种操作条件下的基本放电特性。功能氧化物薄膜如MgO、TiO_2、ZnO和Al_2O_3由于其上级的电学性能,这些材料的光学、机械和生物性质。因此,高质量氧化物薄膜的高速率沉积比以往任何时候都更加需要。在过去,各种技术,如溅射,电子束蒸发,离子镀,和溶胶-凝胶法,已被用于制造氧化物薄膜。溅射法具有低温制备多晶材料、大面积成膜均匀性好、可扩展性强等优点,但由于其沉积速率低,限制了其工业应用 ...更多信息 te.例如,基于溅射的方法中MgO的沉积速率为至多0.5nm/s。为了高速沉积用作等离子体显示器放电电极保护层的高质量氧化镁薄膜,我们提出了一种新的反应溅射工艺,其中传统的平面磁控管(PM)通过电感耦合等离子体(ICP)辅助。1)采用内置单匝线圈天线,成功地制备出高密度ICP。2)采用13.56MHz、几百W的射频功率,制备出密度大于10 μ m的理想ICP<17><-3>。3)作为用图像增强CCD照相机和光谱仪对轴向和径向空间分布的光发射测量的结果,我们已经证实,在靶电极和衬底电极之间产生了理想的ICP。在上述操作条件下,我们证实了ICP和PM的同时操作对溅射金属原子的再电离是有效的。少
项目成果
期刊论文数量(41)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Koji Otomo: "Quantitative Analysis of Hysteresis Characteristics in Reactive Sputtering"Proceedings of The 17th Symposium on Plasma Processing. 177-180 (2000)
大友浩二:《反应溅射中磁滞特性的定量分析》第十七届等离子体加工研讨会论文集。
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Y. Matsuda, K. Tasjhiro, and H. Fujiyama: "Development of Reactive Sputtering Method Assisted by Inductively Coupled Discharege for High-Rate Deposition of Magnesium Oxide"IEICE Technical Report. Vol.101,No.600. 127,EID2001-132,EID2001 (2002)
Y. Matsuda、K. Tasjhiro 和 H. Fujiyama:“开发用于高速沉积氧化镁的感应耦合放电辅助反应溅射方法”IEICE 技术报告。
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Kei Tashiro: "Dynamic Change in Residual Oxygen Pressure during Reactive Sputtering Process of MgO"Proceedings of Plasma Science Symposium 2001/the 18^<th> Symposium on Plasma Processing, January 24-26 2001, Kyoto. 603-604 (2001)
Kei Tashiro:“MgO 反应溅射过程中残余氧压力的动态变化”2001 年等离子体科学研讨会论文集/第 18 次等离子体处理研讨会,2001 年 1 月 24-26 日,京都。
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Y. Matsuda, K. Tashiro, K. Otomo and H. Fujiyama: "Global Quantitative Analysis of Reactive Sputtering Process for MgO Deposition"Proceedings of the 7th International Display Workshops (IDW2000), Nov.29-Dec.1, 2000, Kobe. (invited). 667-670 (2000)
Y. Matsuda、K. Tashiro、K. Otomo 和 H. Fujiyama:“MgO 沉积反应溅射过程的全球定量分析”第七届国际显示研讨会 (IDW2000) 会议记录,2000 年 11 月 29 日至 12 月 1 日,神户
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Y. Matsuda, K. Tashiro, K. Otomo, and H. Fujiyama: "New Reactive Sputtering Model Considering the Effect of the Electron Emission Coefficiency for MgO Deposition"IEICE Trans. Electron.. Vol.E84-C,No.11. 1667-16t72 (2001)
Y. Matsuda、K. Tashiro、K. Otomo 和 H. Fujiyama:“考虑电子发射系数对 MgO 沉积影响的新型反应溅射模型”IEICE Trans。
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MATSUDA Yoshinobu其他文献
MATSUDA Yoshinobu的其他文献
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{{ truncateString('MATSUDA Yoshinobu', 18)}}的其他基金
Development of retarding field energy analyzer that can measure energy distribution of negative ions
开发可测量负离子能量分布的减速场能量分析仪
- 批准号:
16K04995 - 财政年份:2016
- 资助金额:
$ 1.02万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Plasma-Assist Effect on the Sputter-Deposition Process of Transparent Conductive Metal-doped Zinc Oxide Thin Films
等离子体辅助对透明导电金属掺杂氧化锌薄膜溅射沉积过程的影响
- 批准号:
20540485 - 财政年份:2008
- 资助金额:
$ 1.02万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
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