Development of a new bonding method for glass with metal by application of principle of anodic bonding

由于焊料对玻璃的润湿性很差，因此玻璃的焊接需要进行一些预处理，如玻璃表面的金属化或使用特定成分的焊料。为了提高焊料与玻璃的结合力，将阳极键合原理应用于金属与玻璃的焊接，研究了在金属与玻璃焊接过程中，在焊料与玻璃之间施加带有焊料阳极的直流电压，对焊接接头性能的影响。在纯焊锡焊接时，施加适当时间的电压，可提高焊接强度。由于在焊料/玻璃界面处产生过量的氧化锡，电压施加时间过长会损坏连接强度。实际的焊料合金被应用于这种焊接方法，并施加直流电压，“阳极焊接”。直流电压的应用对Sn-3%Sb钎料钎焊具有积极意义。但在Sn-3.5%Ag钎焊时，效果不佳。银不具有与阳极接合的可接合性，因为银在施加电压期间渗透到玻璃中，并且抑制使玻璃和导体紧密接触的库仑力的积累。认为Sn-3.5%Ag中的Ag组分在阳极钎焊中具有类似的作用。锡和锡基焊料的表面覆盖有通过自然氧化而发烟的氧化锡。这种氧化层降低了锡合金对其它材料的润湿性，并干扰了锡合金的连接。为了削弱这种氧化层，对焊料进行卤化处理，并将其应用于阳极焊接。在使用前将焊料暴露于HCl。卤化处理显著提高了焊料对玻璃的润湿性。阳极钎焊中，卤化处理改善了钎料在接头界面的延伸，对接头性能产生了良好的影响。

Soldering of glass needs some pretreatment like metallizing of glass surface or use of solder with particular component because wettability of solder to glass is very poor. In this study, principle of anodic bonding was applied to soldering of metal to glass in order to improve adhesion of solder to glass A.D.C. voltage was applied to solder and glass with the solder anodic during soldering of metal to glass, and effect on performance of joints was investigated. In soldering with pure tin solder application of the voltage for a proper time length improved the joint strength. Too long application of the voltage damaged joint strength, because of excess generation of tin oxide at the solder/glass interface. Practical solder alloys were applied far this soldering method with application of D.C. voltage, 'anodic soldering'. Application of D.C. voltage was active in soldering by Sn-3%Sb solder. But in soldering by Sn-3.5%Ag it was not effective. Silver has no joinability with anodic bonding, because silver penetrates into the glass during application of the voltage, and inhibits buildup of the coulomb force that brings glass and conductor into intimate contact. It was thought that the Ag component in Sn-3.5%Ag had similar effect in anodic soldering. The surfaces of tin and tin-based solder are covered with tin oxide fumed by native oxidation. This oxide layer degrades wettability of tin alloy to other materials and disturbs joining of tin alloys. Halogenation treatment to solder for weakening of this oxide layer was applied to the anodic soldering. Solder was exposed to of HCl just before use. Halogenation improved wettability of solder to glass prominently. In anodic soldering, halogenation treatment improved extension of solder at the joint interface,and produced a good effect on performance of the joints.