Metal plating of Fiber and polymer materials using Super Critical Carbon dioxide

为了使用具有非常轻但非常强的性质的有机纤维和板来制备一些新型的导电线和器件，已经研究了应用超临界二氧化碳的尝试。为了提高金属镀层在纤维和板材上的附着力，选择了合适的有机金属配合物作为镀覆催化剂。首先通过测量在纤维和板材料上的溶解度和亲和力来研究每个纯络合物和络合物混合物的行为。通过采用复合材料和复合浸渍后的高温处理，实现了足够高的镀铜，并对液晶高分子LCP和环氧高分子板进行了特殊处理，其中包括复合材料的浸渍和超临界CO2复合浸渍前的电子束、等离子体和激光辐照。

In order to prepare some new types of electro conductive wires and devices using organic fibers and plates having very light, but very strong properties an attempt has been investigated applying supercritical carbon dioxide. To improve the adhesion properties of metal plating on the fibers and plates, suitable organic metal complexes were selected as catalyst for plating. The behaviors of each pure complex and the complex mixtures were first investigated by measuring the solubility and affinity on the fiber and plate materials. Enough high Cu plating has been done by using complex mixtures and treating at higher temperature after complex impregnation.Some special treatments have been done for liquid crystal polymer LCP and epoxy polymer plate ; one of them the impregnation of complex mixtures and the other one is application of electron beam, plasma and laser irradiation before complex impregnation using supercritical carbon dioxide.