New Interconnections for Massively Parallel and Distributed Systems

随着VLSI技术的不断进步，具有数十到数百个处理单元的多处理器系统有望在未来十年内与当今的超级计算机相抗衡。在文献中确实描述了由几十到一百万个处理元件组成的系统。这种大规模系统的发展将使许多应用，如多媒体、计算机视觉和物理现象建模在桌面工作站上成为可能。然而，设计大规模多处理器系统的一个主要问题是构建灵活的互连网络，以提供高效的处理器间通信和容错技术，以实现更高的可靠性和更高的产量。首先，研究了一种由k元n-立方体连接…组成的新型互连网络--环状连接网格(Tesh由低层节点的网格组成的超模式的更多离子。它的主要特点如下：它是分层的，因此允许利用计算局部性以及易于扩展(多达一百万个处理器)。其次，对Tesh网络的性能进行了评估，结果表明Tesh网络非常适合于三维VLSI实现，因为它需要的垂直布线数量远远少于几乎所有已知的多计算机网络。为了解决垂直链路的限制，增加了Tesh网络的直径，使超过数千个处理单元的网络性能变差。因此，我们提出了一种新型的三维层次互连网络：3D层次环面网络和3D层次网状网络，称为3DH-Mesh。这些3D分层互连网络在保持良好的网络特性的同时，减少了3D堆叠实现中的垂直链路数量。最后介绍了该网络在大规模并行计算中的高级应用。具体地说，我们讨论了一种面向硬件的有序统计图像滤波技术--层叠滤波到Tesh网络的映射。高级链接的映射：Sortinn和EFT到3D分层网络。较少

With the continuing advances in VLSI technology, multiprocessor systems with tens to hundreds of processing elements are expected to rival today's supercomputers in the next decade. Systems consisting of a few tens to a million processing elements have indeed been described in the literatures. The development of such large scale systems will make numerous applications such as multi-media, computer vision, and modeling of physical phenomena to be feasible on desk-top workstations. However, a major issue in designing large scale multiprocessor systems is the construction of a flexible interconnection network to provide efficient inter-processor communication and fault tolerance techniques to achieve both higher reliability and higher production yield.This research report explores new interconnection networks for massively parallel computers and distributed systems. First, the research report a new interconnection network, "Tori connected meshes (TESH)", consisting of k-ary n-cube connect … More ion of supemodes that consist of meshes of lower level nodes. Its key features are the following : it is hierarchical, thus allowing exploitation of computation locality as well as easy expansion (up to a million processors). Second, the performance of TESH network are evaluated and TESH network appears to be well suited for 3-D VLSI implementation, for it requires far fewer number of vertical wires than almost all known multi-computer networks. To solve a restriction of vertical links increases the diameter of TESH networks and makes the network feature worse for more than several thousand processing elements. Thus, we propose new types of three dimensional hierarchical interconnection networks : 3D Hierarchical Torus network, called 3DH-torus and 3D Hierarchical Mesh network, called 3DH-mesh. These 3D hierarchical interconnection networks decrease the number of vertical links in 3D stacked implementation by keeping good network feature. Finally, advanced applications of the network to massively parallel computing are presented. Specifically, we discuss the mapping on to TESH network of stack filtering, a hardware oriented technique for order statistic image filtering. The mapping of advanced anolications : sortinn and EFT to the 3D Hierarchical networks. Less