New Interconnections for Massively Parallel and Distributed Systems
大规模并行和分布式系统的新互连
基本信息
- 批准号:09044150
- 负责人:
- 金额:$ 4.61万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for international Scientific Research
- 财政年份:1997
- 资助国家:日本
- 起止时间:1997 至 1998
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
With the continuing advances in VLSI technology, multiprocessor systems with tens to hundreds of processing elements are expected to rival today's supercomputers in the next decade. Systems consisting of a few tens to a million processing elements have indeed been described in the literatures. The development of such large scale systems will make numerous applications such as multi-media, computer vision, and modeling of physical phenomena to be feasible on desk-top workstations. However, a major issue in designing large scale multiprocessor systems is the construction of a flexible interconnection network to provide efficient inter-processor communication and fault tolerance techniques to achieve both higher reliability and higher production yield.This research report explores new interconnection networks for massively parallel computers and distributed systems. First, the research report a new interconnection network, "Tori connected meshes (TESH)", consisting of k-ary n-cube connect … More ion of supemodes that consist of meshes of lower level nodes. Its key features are the following : it is hierarchical, thus allowing exploitation of computation locality as well as easy expansion (up to a million processors). Second, the performance of TESH network are evaluated and TESH network appears to be well suited for 3-D VLSI implementation, for it requires far fewer number of vertical wires than almost all known multi-computer networks. To solve a restriction of vertical links increases the diameter of TESH networks and makes the network feature worse for more than several thousand processing elements. Thus, we propose new types of three dimensional hierarchical interconnection networks : 3D Hierarchical Torus network, called 3DH-torus and 3D Hierarchical Mesh network, called 3DH-mesh. These 3D hierarchical interconnection networks decrease the number of vertical links in 3D stacked implementation by keeping good network feature. Finally, advanced applications of the network to massively parallel computing are presented. Specifically, we discuss the mapping on to TESH network of stack filtering, a hardware oriented technique for order statistic image filtering. The mapping of advanced anolications : sortinn and EFT to the 3D Hierarchical networks. Less
随着超大规模集成电路技术的不断进步,具有数十到数百个处理元件的多处理器系统有望在未来十年内与今天的超级计算机相媲美。在文献中确实描述了由几十到一百万个处理元件组成的系统。这种大规模系统的发展将使许多应用,如多媒体,计算机视觉和物理现象的建模,在桌面工作站上是可行的。然而,在设计大规模多处理器系统的一个主要问题是一个灵活的互连网络的建设,提供有效的处理器间的通信和容错技术,以实现更高的可靠性和更高的生产yield.This研究报告探讨了新的互连网络的大规模并行计算机和分布式系统。首先,研究了一种新的互连网络-“Tori连通mesh(TESH)",它由k元n-立方体连接组成 ...更多信息 由较低级别节点的网格组成的超模型的离子。它的主要特点如下:它是分层的,因此允许利用计算局部性以及易于扩展(多达一百万个处理器)。其次,TESH网络的性能进行了评估和TESH网络似乎是非常适合于3-D VLSI实现,因为它需要的垂直线的数量远远少于几乎所有已知的多计算机网络。为了解决垂直链接的限制,增加了TESH网络的直径,并使网络功能更差,超过几千个处理元件。因此,我们提出了新类型的三维分层互连网络:三维分层环面网络,称为3DH-torus和三维分层网状网络,称为3DH-mesh。这些3D层次互连网络通过保持良好的网络特性,减少了3D堆叠实现中的垂直链路的数量。最后,先进的应用程序的网络大规模并行计算。具体来说,我们讨论了堆栈滤波,面向硬件的顺序统计图像滤波技术的TESH网络的映射。高级模拟的映射:排序和EFT到3D分层网络。少
项目成果
期刊论文数量(0)
专著数量(0)
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专利数量(0)
R.Hayashi and S.Horiguchi: "Parallel Molecular Dynamics Simulations of Polymers, in Japanese" Trans.of Information Processing Society of Japan. Vol.39, No.6. 1775-1181 (1998)
R.Hayashi 和 S.Horiguchi:“聚合物的并行分子动力学模拟,日语”Trans.of 日本信息处理学会。
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S.Horiguchi, T.Ooki and V.K.Jain,: "Network Performance of TESH : A New Hierarchical Interconnection Network for 3-D Integration." Proc.Int'l Conf.on Parallel and Disctributed Computing and Networks,. 170-175 (1998)
S.Horiguchi、T.Ooki 和 V.K.Jain:“TESH 的网络性能:用于 3D 集成的新型分层互连网络。”
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V.K.Jain and S.Horiguchi: "Architecture, Defect Tolerance and Buffer Design for a New ATM Switch" IEEE Trans.on Components, Packaging, and Manufacturing Tech.-Part B. Vol.21, No.4. 338-345 (1998)
V.K.Jain 和 S.Horiguchi:“新型 ATM 交换机的架构、缺陷容限和缓冲器设计”IEEE Trans.on 组件、封装和制造技术 - B 部分。第 21 卷,第 4 期。
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S.Horiguchi and M.Konuki: ""The Horizontal Rotate Crossed Cube : HCQ Interconnection Network"" Proc.of IEEE International Sympsium on Parallel Architectures,Algorithms and Netwroks. 118-124 (1997)
S.Horiguchi 和 M.Konuki:“水平旋转交叉立方体:HCQ 互连网络”Proc.of IEEE 国际并行架构、算法和网络研讨会。
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V. K. Jain and S. Horiguchi: "VLSI Considerations for TESH: A New Hierarchical Interconnection Network for 3-D Integration"IEEE Trans. VLSI Systems. Vol. 6, No. 3. 346-353 (1998)
V. K. Jain 和 S. Horiguchi:“TESH 的 VLSI 考虑因素:用于 3D 集成的新型分层互连网络”IEEE Trans。
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HORIGUCHI Susumu其他文献
HORIGUCHI Susumu的其他文献
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{{ truncateString('HORIGUCHI Susumu', 18)}}的其他基金
Network Architectures for High-speed Photonic Networks
高速光子网络的网络架构
- 批准号:
17300010 - 财政年份:2005
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Non-blocking Network Architectures for High-speed Switching Networks
高速交换网络的无阻塞网络架构
- 批准号:
14380138 - 财政年份:2002
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Super-Reality Tele-Interaction Using Haptic Environments
使用触觉环境的超现实远程交互
- 批准号:
11792024 - 财政年份:1999
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for University and Society Collaboration
Self-Reconfigufation Architecture of Mesh-Connected Network for Multiprocessor Systems and The Implemantation
多处理器系统网状网络自重构架构及实现
- 批准号:
11558032 - 财政年份:1999
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Massively Parallel Networks in 3D-Stacked Silicon Wafers
3D 堆叠硅片中的大规模并行网络
- 批准号:
09480051 - 财政年份:1997
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Study on Massively Parallel Simulations and Visualizations
大规模并行仿真与可视化研究
- 批准号:
07308063 - 财政年份:1995
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Super-Reality Systems based on 3D-Computer Graphics
基于 3D 计算机图形学的超现实系统
- 批准号:
06558040 - 财政年份:1994
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for Developmental Scientific Research (B)
Self-Reconfigurable Massively Parallel Computer on Stacked Wafers
堆叠晶圆上的自重构大规模并行计算机
- 批准号:
05044090 - 财政年份:1993
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for international Scientific Research
Self-Reconfiguration for Wafer Scale Integrated Computer
晶圆级集成计算机的自重构
- 批准号:
05808029 - 财政年份:1993
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for General Scientific Research (C)
Research on Wafer Scale Integrated Computer
晶圆级集成计算机的研究
- 批准号:
02805042 - 财政年份:1990
- 资助金额:
$ 4.61万 - 项目类别:
Grant-in-Aid for General Scientific Research (C)