Self-Reconfigurable Massively Parallel Computer on Stacked Wafers
Self-Reconfigurable Massively Parallel Computer on Stacked Wafers
批准号:
05044090
负责人:
HORIGUCHI Susumu
金额:
$15.36万
依托单位国家:
日本
项目类别:
Grant-in-Aid for international Scientific Research
财政年份:
1993
资助国家:
日本
项目状态:
已结题
起止时间:
1993 至 1995
中文摘要
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英文摘要
This research deals with a 3D-mesh array on stacked wafers and its fault tolerant architecture. The architecture of 3D-mesh arrays provides a self-reconfiguration of interconnections using a recursive shift scheme. Anuj Chandra et al. also proposed a reconfigurable algorithm for 3D 1/ track model based on a compensation path scheme that was originally proposed S.Y.Kung et al. The 3D 1/ track model was, however, discussed only from the theoretical view points of extension of the 2D 1/ track model. This paper examines its fault tolerant performance to obtain the system yield of a 3D-mesh array using a self-reconfiguration scheme.First, we reviews recent WSI devices to construct massively parallel computers and summarize the merit of WSI parallel computers. Next. we deal with the mesh-connected multiprocessor architecture and reconfiguration stategies to enhance the array yield for WSI implementation. Reconfiguration performance of a mesh-connected parallel computer is discussed by comparing it to previous works. WSI implementation of a cube-connected cycles (CCC) is addressed and its yield performance is discussed by taking into account the chip area of the PEs, switches, and links. We also propose a new interconnection network HCQ based on a crossed cube interconnection to reduce the diameter and the average distance of the interconnection network. The excellent network property of HCQ is theoretically investigated. Finally, we discussed a 3D-mesh array on stacked wafers for massively parallel computers. A reconfiguration algorithm based on a recursive shift scheme is proposed. Applying the recursive shift scheme to a 3D-mesh array, it is shown that the reconfiguration performance becomes high and provides the possibility to construct a massively parallel computer on stacked wafers like as the 3D-mesh array.
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V.K.Jain,T.Ghirmai and S.Horiguchi: ""TESH : A New Hierarchical Interconnection Network for massively Parallel Computing"" submitted to IEEE Trans.on Parallel and Distributed System. (1996)
V.K.Jain、T.Ghirmai 和 S.Horiguchi:“TESH:用于大规模并行计算的新型分层互连网络”提交给 IEEE Trans.on 并行和分布式系统。
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沼田 一成: "格子型マルチプロセッサシステムのWSI構成法" 電子情報通信学会論文誌D-I.vol.J77-D-I. No.2. 121-129 (1993)
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I.Numata and S.Horiguchi: ""Wafer-Scale Integration Implementation of Mesh-Connected Multiprocessor Systems"," Systems and Computers in Japan,. vol.26,No.1,. 1-10 (1995)
I.Numata 和 S.Horiguchi:“网状连接多处理器系统的晶圆级集成实现”,《日本系统与计算机》。
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Susumu Horiguchi: "“Yield Enhancement Architecture of WSI Cube-Connected Cycle"" Proc.IEEE Int'l Conf.WSI. 61-68 (1993)
Susumu Horiguchi:“WSI 立方体连接循环的产量增强架构”,Proc.IEEE Intl Conf.WSI(1993 年)。
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共 24 条
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财政年份:2005
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财政年份:1999
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Self-Reconfigufation Architecture of Mesh-Connected Network for Multiprocessor Systems and The Implemantation
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批准号:11558032
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项目类别:Grant-in-Aid for Scientific Research (B)
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资助金额:$6.21万
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财政年份:1999
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负责人:HORIGUCHI Susumu
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New Interconnections for Massively Parallel and Distributed Systems
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批准号:09044150
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财政年份:1997
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依托单位:
Massively Parallel Networks in 3D-Stacked Silicon Wafers
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批准号:09480051
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项目类别:Grant-in-Aid for Scientific Research (B)
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资助金额:$3.26万
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财政年份:1997
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Study on Massively Parallel Simulations and Visualizations
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Super-Reality Systems based on 3D-Computer Graphics
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财政年份:1994
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Self-Reconfiguration for Wafer Scale Integrated Computer
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资助金额:$1.22万
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财政年份:1993
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负责人:HORIGUCHI Susumu
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依托单位:
Research on Wafer Scale Integrated Computer
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海外基金