Laser dicing of thick and brittle wafers: Lithium Niobate case

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This project will seek to develop an innovative and first-of-a-kind laser processing solution for dicing (cutting through) thick and brittle wafers in single-layer or multi-layer arrangements, which is targeted towards the semiconductor fabrication industry. The commercial benefits expected to arise from the project are elimination of chipping, delamination and cracking associated with currently used blade dicing. In this project we will use Lithium Niobate (LiNbO3) wafers for the development of our proposed laser processing technique. LiNbO3 wafers are used extensively in high-tech photonic, piezoelectric, and electro-optic devices.This project is being led by Advancete limited, a UK based company. Advancete is a start-up with a successful trading record of 6 years with expertise in laser processing techniques for advanced manufacturing applications in a wide range of industries such as Electronics, Aerospace, Energy, etc.