Laser dicing of thick and brittle wafers: Lithium Niobate case

该项目将寻求开发一种创新的和首个同类的激光加工解决方案，用于切割（切割）单层或多层布置的厚而脆的晶片，该方案针对半导体制造业。预计该项目将带来的商业效益是消除与目前使用的刀片切割相关的碎裂、分层和开裂。在这个项目中，我们将使用铌酸锂（LiNbO3）晶片来开发我们提出的激光加工技术。LiNbO3晶片广泛应用于高科技光子、压电和电光器件。该项目由英国Advancete有限公司领导。Advancete是一家拥有6年成功交易记录的初创企业，拥有激光加工技术的专业知识，可用于电子，航空航天，能源等广泛行业的先进制造应用。

This project will seek to develop an innovative and first-of-a-kind laser processing solution for dicing (cutting through) thick and brittle wafers in single-layer or multi-layer arrangements, which is targeted towards the semiconductor fabrication industry. The commercial benefits expected to arise from the project are elimination of chipping, delamination and cracking associated with currently used blade dicing. In this project we will use Lithium Niobate (LiNbO3) wafers for the development of our proposed laser processing technique. LiNbO3 wafers are used extensively in high-tech photonic, piezoelectric, and electro-optic devices.This project is being led by Advancete limited, a UK based company. Advancete is a start-up with a successful trading record of 6 years with expertise in laser processing techniques for advanced manufacturing applications in a wide range of industries such as Electronics, Aerospace, Energy, etc.