Quantum Technology Capital: Quantum Photonic Integrated Circuits (QuPIC)

点击翻译按钮获取中文摘要

We will establish a UK quantum device prototyping service, focusing on design, manufacture, test, packaging and rapid device prototyping of quantum photonic devices. QuPIC will provide academia and industry with an affordable route to quantum photonic device fabrication through commercial-grade fabrication foundries and access to supporting infrastructure. QuPIC will provide qualified design tools tailored to each foundry's fabrication processes, multiproject wafer access, test and measurement, and systems integration facilities, along with device prototyping capabilities. The aim is to enable greater capability amongst quantum technology orientated users by allowing adopters of quantum photonic technologies to realise advanced integrated quantum photonic devices, and to do so without requiring in-depth knowledge. We will bring together an experienced team of engineers and scientists to provide the required breadth of expertise to support and deliver this service.Four work packages deliver the QuPIC service. They are:WP1 - Design tools for photonic simulation and design software, thermal and mechanical design packages and modellingWP2 - Wafer fabrication - Establishing the qualified component library for the different fabrication processes and materials and offering users a multi-project wafer serviceWP3 - Integrated device test and measurement - Automated wafer scale electrical and optical characterisation, alignment systems, cryogenic systems to support single-photon detector integration)WP4 - Packaging and prototyping - Tools for subsystem integration into hybrid and functionalised quantum photonic systems and the rapid prototyping of novel, candidate component designs before wafer-scale manufacturing and testingThe design tools (WP1) will provide all the core functionality and component libraries to allow users to design quantum circuits, for a range of applications. We will work closely with fabrication foundries (WP2) to qualify the design libraries and to provide affordable access to high-quality devices via a multi-project wafer approach, where many users share the fabrications costs. Specialist test and measurement facilities (WP3) will provide rapid device characterization (at the wafer level), whilst packaging and prototyping tools (WP4) will allow the assembly of subsystems into highly functionalised quantum photonic systems.