Quantum Technology Capital: Quantum Photonic Integrated Circuits (QuPIC)

量子科技资本：量子光子集成电路（QuPIC）

• 批准号: EP/N015126/1
• 负责人: Mark Thompson
• 金额: $ 582.93万
• 依托单位: University of Bristol
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2016
• 资助国家: 英国
• 起止时间: 2016 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FN015126%2F1
• 关键词: Quantum; Technology; Capital; Photonic; Integrated

We will establish a UK quantum device prototyping service, focusing on design, manufacture, test, packaging and rapid device prototyping of quantum photonic devices. QuPIC will provide academia and industry with an affordable route to quantum photonic device fabrication through commercial-grade fabrication foundries and access to supporting infrastructure. QuPIC will provide qualified design tools tailored to each foundry's fabrication processes, multiproject wafer access, test and measurement, and systems integration facilities, along with device prototyping capabilities. The aim is to enable greater capability amongst quantum technology orientated users by allowing adopters of quantum photonic technologies to realise advanced integrated quantum photonic devices, and to do so without requiring in-depth knowledge. We will bring together an experienced team of engineers and scientists to provide the required breadth of expertise to support and deliver this service.Four work packages deliver the QuPIC service. They are:WP1 - Design tools for photonic simulation and design software, thermal and mechanical design packages and modellingWP2 - Wafer fabrication - Establishing the qualified component library for the different fabrication processes and materials and offering users a multi-project wafer serviceWP3 - Integrated device test and measurement - Automated wafer scale electrical and optical characterisation, alignment systems, cryogenic systems to support single-photon detector integration)WP4 - Packaging and prototyping - Tools for subsystem integration into hybrid and functionalised quantum photonic systems and the rapid prototyping of novel, candidate component designs before wafer-scale manufacturing and testingThe design tools (WP1) will provide all the core functionality and component libraries to allow users to design quantum circuits, for a range of applications. We will work closely with fabrication foundries (WP2) to qualify the design libraries and to provide affordable access to high-quality devices via a multi-project wafer approach, where many users share the fabrications costs. Specialist test and measurement facilities (WP3) will provide rapid device characterization (at the wafer level), whilst packaging and prototyping tools (WP4) will allow the assembly of subsystems into highly functionalised quantum photonic systems.

我们将建立英国量子器件原型服务，专注于量子光子器件的设计、制造、测试、封装和快速器件原型。QuPIC将通过商业级制造代工厂和配套基础设施，为学术界和工业界提供经济实惠的量子光子器件制造途径。QuPIC将为每家代工厂的制造工艺、多项目晶圆接入、测试和测量、系统集成设施以及设备原型设计能力提供量身定制的合格设计工具。其目的是通过允许量子光子技术的采用者实现先进的集成量子光子设备，从而使量子技术导向的用户具有更大的能力，而无需深入的知识。我们将汇集一个经验丰富的工程师和科学家团队，提供所需的专业知识来支持和提供这项服务。四个工作包交付QuPIC服务。它们是：WP1 -用于光子模拟和设计软件的设计工具，热学和机械设计软件包和建模；wp2 -晶圆制造-为不同的制造工艺和材料建立合格的组件库，并为用户提供多项目晶圆服务；ewp3 -集成设备测试和测量-自动化晶圆尺度电气和光学特性，对准系统；WP1 -封装和原型设计-用于将子系统集成到混合和功能化量子光子系统中的工具，以及在晶圆级制造和测试之前对新型候选组件设计进行快速原型设计。设计工具（WP1）将提供所有核心功能和组件库，以允许用户设计量子电路，用于一系列应用。我们将与制造代工厂（WP2）密切合作，以确定设计库的资格，并通过多项目晶圆方法提供负担得起的高质量器件，其中许多用户分担制造成本。专业测试和测量设施（WP3）将提供快速的器件表征（在晶圆级），而封装和原型工具（WP4）将允许子系统组装成高度功能化的量子光子系统。

项目成果

First cryogenic electro-optic switch on silicon with high bandwidth and low power tunability

第一个具有高带宽和低功耗可调性的低温硅电光开关

• DOI: 10.1109/iedm.2018.8614511
• 发表时间: 2018
• 作者: Eltes F

Low-loss GHz frequency phononic integrated circuits in Gallium Nitride for compact radio-frequency acoustic wave devices.

用于紧凑型射频声波器件的低损耗 GHz 频率氮化镓声子集成电路。

• DOI: 10.1109/tuffc.2023.3332146
• 发表时间: 2023
• 期刊: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
• 作者: Bicer M

Gallium nitride phononic integrated circuits platform for GHz frequency acoustic wave devices

• DOI: 10.1063/5.0082467
• 发表时间: 2022-06-13
• 期刊: APPLIED PHYSICS LETTERS
• 影响因子: 4
• 作者: Bicer, Mahmut;Valle, Stefano;C. Balram, Krishna
• 通讯作者: C. Balram, Krishna

Integrate and scale: A source of spectrally separable photon pairs

• DOI: 10.1364/optica.491965
• 发表时间: 2023-03
• 期刊: Optica
• 影响因子: 10.4
• 作者: Ben M. Burridge;I. Faruque;J. Rarity;J. Barreto

Evaluating the interfacial toughness of GaN-on-diamond with an improved analysis using nanoindentation

使用纳米压痕改进分析来评估金刚石基氮化镓的界面韧性

• DOI: 10.1016/j.scriptamat.2021.114370
• 发表时间: 2022
• 期刊: Scripta Materialia
• 影响因子: 6
• 作者: Field D