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CDT Compound Semiconductor Physics (PhD Progression 1+3)

CDT 化合物半导体物理（博士进修 1 3）

基本信息

批准号：
2881686
负责人：
金额：
--
依托单位：
CARDIFF UNIVERSITY
依托单位国家：
英国
项目类别：
Studentship
财政年份：
2023
资助国家：
英国
起止时间：
2023 至无数据
项目状态：
未结题

来源：
https://gtr.ukri.org/projects?ref=studentship-2881686
关键词：
CDT Compound Semiconductor Physics PhD

项目摘要

There is an increasing need for photonic integrated circuits (PICs) to advance technologies in sensing, datacoms and AI. These rely on complex optical circuitry containing passive and active compound semiconductor components, densely packed onto a wafer. The efficiency and functionality of the PIC depends strongly on the architecture of the building blocks and how they are connected. The structures here will be based on the indium phosphide (InP) material system; historically this has been widely used for generation, detection and amplification of light at the communication bandwidths. Versatile yet robust fabrication methods are required and in this project, fabrication of high-density PICs and complex epitaxial structures such as those used in quantum cascade lasers (QCLs) will be developed. As technology matures, the scale and complexity of manufacturing naturally increases. This presents processing challenges, particularly for InP, and this project will focus on the scaling and functionality of PICs which contain a high-density of micro/nano-structures, e.g. high aspect-ratio gratings and waveguides, studying the impact of dopants and composition on etching profiles. For certain components such as lasers or optical amplifiers, the application of thin-film coatings for high/low reflectivity (HR/AR) will be required and methods to apply these films as part of wafer-scale processing will be investigated.

人们越来越需要光子集成电路（PIC）来推进传感、计算机和人工智能技术。这些依赖于复杂的光学电路，包含密集封装在晶片上的无源和有源化合物半导体元件。PIC的效率和功能在很大程度上取决于构建块的架构以及它们的连接方式。这里的结构将基于磷化铟（InP）材料系统;历史上，这已被广泛用于通信带宽的光的产生，检测和放大。需要通用且稳健的制造方法，在该项目中，将开发高密度PIC和复杂外延结构（例如量子级联激光器（QCL）中使用的结构）的制造。随着技术的成熟，制造业的规模和复杂性自然会增加。这提出了加工挑战，特别是对于InP，该项目将专注于包含高密度微/纳米结构的PIC的缩放和功能，例如高纵横比光栅和波导，研究掺杂剂和成分对蚀刻轮廓的影响。对于某些组件，如激光器或光学放大器，将需要应用高/低反射率（HR/AR）的薄膜涂层，并将研究将这些薄膜作为晶圆级加工的一部分的方法。