Dual Source Pulsed Plasmas for the Production of Ultra-High Performance Coatings

用于生产超高性能涂层的双源脉冲等离子体

• 批准号: EP/E003397/1
• 负责人: James Bradley
• 金额: $ 34.42万
• 依托单位: University of Liverpool
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2007
• 资助国家: 英国
• 起止时间: 2007 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FE003397%2F1
• 关键词: Dual; Source; Pulsed; Plasmas; Production

Pulsed processing has initiated a new era in surface engineering technologies. For example, pulsed magnetron sputtering has transformed the deposition of dielectric materials. The benefits of pulsed processing can be further capitalised on through the application of mid-frequency pulsed DC power at the substrate. This 'dual source' sputtering mode uses one pulsed power source to generate a plasma in front of the target and a second, similar, source to excite a plasma in front of the substrate. This enables the deposition conditions at the substrate to be controlled independent of the sputtering conditions in a flexible and versatile manner. This offers a new and exciting means of controlling the energy delivered to the substrate during film deposition, which is a critical factor in determining the microstructures and properties of magnetron sputtered coatings. To date, this technique has been largely overlooked. We aim, therefore, to perform the first detailed study of this technique, with a view to producing ultra-high performance coatings, particularly aimed at applications such as dry machining and dry-running components, where environmental pressures to reduce the use of hydrocarbon lubricants demand coatings with properties that present technologies are struggling to deliver.We will investigate the use of dual source discharges in the enhancement and control of the ion-to-atom ratio incident at the substrate during deposition and the effectiveness of the ion etch process prior to deposition. However, in order to exploit the full potential of this new technique, it will also be necessary to undertake detailed measurements of the plasma. Thus, this study will also lead to the advancement of plasma measurement techniques in pulsed discharges. The information gained will allow us to determine the interrelationships between the driving voltage waveforms at the targets and at the substrate and the nature of the multi-excited discharge that forms, and their combined impact on film growth.

脉冲处理技术开创了表面工程技术的新时代。例如，脉冲磁控溅射改变了介电材料的沉积。通过在基板上应用中频脉冲直流电源，可以进一步利用脉冲处理的好处。这种“双源”溅射模式使用一个脉冲电源在目标前方产生等离子体，另一个类似的源在衬底前方激发等离子体。这使得基底上的沉积条件能够以灵活和通用的方式独立于溅射条件进行控制。这为控制薄膜沉积过程中传递到衬底的能量提供了一种令人兴奋的新方法，这是决定磁控溅射涂层微观结构和性能的关键因素。迄今为止，这项技术在很大程度上被忽视了。因此，我们的目标是对这项技术进行首次详细研究，以期生产出超高性能的涂料，特别是针对干式加工和干式运行部件等应用，在这些应用中，环境压力减少了碳氢化合物润滑剂的使用，需要具有现有技术难以实现的性能的涂料。我们将研究使用双源放电来增强和控制沉积过程中入射到衬底的离子原子比，以及沉积前离子蚀刻工艺的有效性。然而，为了充分利用这项新技术的潜力，还需要对等离子体进行详细的测量。因此，这项研究也将导致脉冲放电等离子体测量技术的进步。获得的信息将使我们能够确定目标和衬底驱动电压波形之间的相互关系，以及形成的多激励放电的性质，以及它们对薄膜生长的综合影响。

项目成果

Cathode Current Density Distributions in High Power Impulse and Direct Current Magnetron Sputtering Modes

• DOI: 10.1002/ppap.200931201
• 发表时间: 2009-06
• 期刊: Plasma Processes and Polymers
• 影响因子: 3.5
• 作者: G. Clarke;A. Mishra;P. Kelly;J. Bradley

High Temporal Resolution Ion Energy Distribution Functions in HIPIMS Discharges

HIPIMS 放电中的高时间分辨率离子能量分布函数

• DOI: 10.1002/ppap.200931601
• 发表时间: 2009
• 期刊: Plasma Processes and Polymers
• 影响因子: 3.5
• 作者: Mishra A

Time-resolved plasma characterisation of modulated pulsed power magnetron sputtering of chromium

铬调制脉冲功率磁控溅射的时间分辨等离子体表征

• DOI: 10.1016/j.surfcoat.2011.01.017
• 发表时间: 2011
• 期刊: Surface and Coatings Technology
• 影响因子: 5.4
• 作者: Liebig B