High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits

适用于毫米波和太赫兹集成电路的高性能、优化芯片级封装

• 批准号: LP140100344
• 负责人: Prof Michael Heimlich
• 金额: $ 31.72万
• 依托单位: Macquarie University
• 依托单位国家: 澳大利亚
• 项目类别: Linkage Projects
• 财政年份: 2015
• 资助国家: 澳大利亚
• 起止时间: 2015-05-15 至 2020-12-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/LP140100344
• 关键词: performance; optimized; chip; scale; packaging

This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.

该项目旨在通过在高性能毫米波和太赫兹集成电路上沉积一层薄薄的钻石保护层来彻底改变电子封装。利用现有技术从高功率光学电子器件中去除热量，该项目旨在提供小型化封装芯片，免受环境影响，并准备安装在系统中，而不会像当前封装技术那样严重降低电路的性能。该项目旨在实现更便宜和更节能的应用，如无线高清视频、千兆电信和黑体无源成像技术，用于安全、国防、医疗和农业应用。