Electron-beam Deposition System for Nanofabrication Processes

用于纳米加工工艺的电子束沉积系统

• 批准号: RTI-2017-00537
• 负责人: LagugnéLabarthet, François
• 金额: $ 10.93万
• 依托单位: University of Western Ontario
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments
• 财政年份: 2016
• 资助国家: 加拿大
• 起止时间: 2016-01-01 至 2017-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=616704
• 关键词: Electron; beam; Deposition; System; Nanofabrication

Micro and Nano-fabrication technologies involve multiple complex steps in an effort to fabricate miniaturized structures and devices with a high degree of reproducibility and quality. Among the steps that are essential to make a functional device, deposition of metallic thin films (gold, silver, chromium, and platinum) are central to any fabrication of micro- and nano-scale devices. An electron beam (e-beam) deposition system is an apparatus where an electron beam is produced under high vacuum environment and focused onto a metal target. The metal atoms are then ejected by the electron flux and are deposited onto a target where the micro- and nanostructures are produced. Deposition by electron beam provides a highly-controlled rate of deposition resulting in a uniform and pristine metal surface. This technology allows one to conceive and fabricate a collection of micro- and nano-features over the surface of a single 4-inch wafer. In a typical multi-step fabrication process, the electron beam deposition system is used repeatedly throughout the sequence. For example, an adhesion layer comprised of titanium or chromium is deposited onto a semiconductor surface prior to deposition of a gold layer. Devices prepared in the Western Nanofabrication Facility typically have 3 or more layers. Layer thickness depends on the role of the layer in the final device and can vary from several nanometers to hundreds of nanometers. A high-quality e-beam deposition system is therefore the key to the success of any advanced fabrication procedure at the nanoscale. The Western Nanofabrication Facility being fully compatible with 4-inch wafers, wishes to acquire an e-beam deposition system capable of processing these wafers. The present system operating in the Western Nanofabrication Facility is an open user apparatus and was produced in the 1980’s. It is one of the busiest machines in the Nanofabrication Facility. However, its electronic, pumping and safety operation are obsolete by today’s standards, which emphasizes the urgent need for a replacement. Furthermore, a new instrument would greatly improve the uniformity and purity of each prepared metal layer, which provides our researchers with advanced capabilities to explore new methods and devices at the nano-scale.

微米和纳米制造技术涉及多个复杂的步骤，以努力制造具有高度再现性和质量的小型化结构和器件。在制造功能性器件所必需的步骤中，金属薄膜（金、银、铬和铂）的沉积是任何微米和纳米级器件制造的核心。电子束（e-beam）沉积系统是在高真空环境下产生电子束并将其聚焦到金属靶上的设备。然后，金属原子被电子通量喷射并沉积到产生微米和纳米结构的靶上。通过电子束的沉积提供了高度受控的沉积速率，导致均匀和原始的金属表面。这项技术允许人们在单个4英寸晶片的表面上构思和制造一系列微米和纳米特征。在典型的多步骤制造工艺中，在整个序列中重复使用电子束沉积系统。例如，在沉积金层之前，将由钛或铬组成的粘附层沉积到半导体表面上。在Western Nanofabetting Facility中制备的器件通常具有3层或更多层。层厚度取决于层在最终器件中的作用，并且可以从几纳米到几百纳米变化。 因此，高质量的电子束沉积系统是任何先进的纳米级制造工艺成功的关键。西部纳米工厂与4英寸晶圆完全兼容，希望获得能够处理这些晶圆的电子束沉积系统。在西部纳米工厂中操作的本系统是开放式用户设备，并且是在20世纪80年代生产的。它是纳米制造工厂中最繁忙的机器之一。然而，它的电子，泵和安全操作是过时的今天的标准，这强调了迫切需要更换。此外，一种新的仪器将大大提高每个制备的金属层的均匀性和纯度，这为我们的研究人员提供了在纳米尺度上探索新方法和设备的先进能力。