Configurable Integrated Power Input/Output Systems for Avionic Applications

泰利斯加拿大公司开发用于航空电子应用的控制系统，这些应用在恶劣的环境中运行，这些环境可能会损害非常高密度芯片的功能：电磁干扰，雷击和宇宙辐射。该公司需要为不同的航空电子应用开发一种通用的电源接口，这些应用具有高水平的关键性：飞行控制，扰流板控制，襟翼控制。然而，这种电路在作为分立元件实现时需要在PCB上占用大量空间，例如在公司的现有产品中。ASIC和分立元件之间的合理权衡是系统级封装（SiP）的概念。SiP允许在裸芯片之间具有非常密集的互连的同一封装内有多个集成电路。此外，SiP技术现在允许异构技术的芯片集成在同一封装内，为设计人员提供了更大的灵活性。在适合航空电子设备的高可靠性环境中，通过SiP技术将高功率和高压系统沿着与低功率系统进行异构集成是该合作研究项目的重点。虽然ASIC是一种有吸引力的解决方案，但在考虑高电压输入时，可能会出现诸如介电击穿之类的鲁棒性问题。最终，整个电源系统的SiP集成将显著降低电源电路的PCB尺寸，并可能增强功能。因此，该研究项目的主要目标是详细说明为恶劣条件下的运输车辆设计紧凑，可配置和集成的输入/输出动力系统的方法和技术。一个高度灵活和可重构的元素，以支持多个电力系统的监测和控制功能的集合将被调查。这些方法和技术将允许将这些异构元件集成到SiP模块的最小集合中。在成功完成这项研究后，一个新的灵活的电源系统将根据航空电子行业所需的功率，响应时间和精度方面的不同规格进行配置。

Thales Canada's develops control systems for avionics applications, which operate in harsh environments that may compromise the functionality of very high density chips: electromagnetic interference, lightning strikes and cosmic radiations. The company needs to develop a generic power interface for different avionics applications with a high level of criticality : flight control, spoilers control, flaps control. However, such circuitry requires a lot of space on PCBs when implemented as discrete components, such as in the company's existing products. A reasonable trade-off between ASICs and discrete components is the concept of System in Package (SiP). SiP allows more than one integrated circuit inside the same package with very dense interconnects between bare-dies. Also, SiP technology now allows chips of heterogeneous technologies to be integrated inside the same package, giving designers more flexibility. Heterogeneous integration of high power and high voltage systems along with lower power systems through SiP technologies in a high reliability context suited to avionics is the focus of this collaborative research project. While ASIC are an attractive solution, robustness problems, such as dielectric breakdown, may emerge when considering high voltage inputs. Ultimately, SiP integration of the entire power system would be a significant reduction in the PCB dimensions for the power circuits and potentially enhanced functionality. Accordingly, the main objective of the research project is to elaborate methods and techniques to design compact, configurable and integrated input/output power systems for transportation vehicles under harsh conditions. A collection of highly flexible and reconfigurable elements to support a plurality of monitoring and controlling functions for power systems will be investigated. These methods and techniques will allow integrating these heterogeneous elements into a minimum set of SiP modules. Upon successful completion of this research, a new flexible power system will be configurable according to different specifications in terms of power, response time and accuracy that are required in the avionics industries.